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TECHNICAL BRIEFS

Reliability of Lead-Free Solder Joints

[+] Author and Article Information
John H. Lau

 Agilent Technologies, Inc., 5301 Stevens Creek Boulevard, Santa Clara, CA 95051john_lau@agilent.com

J. Electron. Packag 128(3), 297-301 (Jul 26, 2006) (5 pages) doi:10.1115/1.2229234 History: Received October 07, 2005; Revised July 26, 2006

Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.

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Copyright © 2006 by American Society of Mechanical Engineers
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References

Figures

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Figure 2

Young’s modulus of lead-free and tin-lead solders

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Figure 3

Tensile creep strain rate for SnAgCu and Sn37Pb solder alloys at 50°C

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Figure 4

Thermal cycling test of lead-free 256-Pin PBGA package on PCB (−25–125°C, one cycle per hour)

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Figure 5

256-Pin PBGA with 25°C, 1h thermal cycle)

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Figure 1

Reliability engineering

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