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TECHNICAL BRIEFS

A Three-Dimensional Solder Shape Model Incorporating Top Pad Inclination and Misalignment

[+] Author and Article Information
Mahidhar Rayasam

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

Ganesh Subbarayan

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907ganeshs@purdue.edu

J. Electron. Packag 128(3), 291-293 (Aug 27, 2005) (3 pages) doi:10.1115/1.2229232 History: Received August 30, 2004; Revised August 27, 2005

In this technical brief, we describe a simple, yet versatile solder shape prediction model that can handle inclination (as is likely to occur when warped substrates are used) and misalignment of the top pad of the solder joint relative to the bottom pad. The developed model is general in nature and is demonstrated on a solder joint with circular top and bottom pads and on a stud joint where the interconnection is to a stud on which the wetted area is to be determined through simulation. The model was able to accurately predict the solder profiles from literature with an error of ±5%. A program written within the MATHEMATICA ® environment was developed and used for the above simulations.

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Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 4

Projection of inclined frustum onto the YZ plane

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Figure 3

Projections of major and minor axes

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Figure 2

Differential slice of the solder joint

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Figure 1

Modeling of the stud joint as a composition of two primitive geometries

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