Heat Sinks With Enhanced Heat Transfer Capability for Electronic Cooling Applications

[+] Author and Article Information
Evan Small, Sadegh M. Sadeghipour, Mehdi Asheghi

Mechanical Engineering Department,  Carnegie Mellon University, Pittsburgh, PA 15213

J. Electron. Packag 128(3), 285-290 (Nov 07, 2005) (6 pages) doi:10.1115/1.2229230 History: Received August 17, 2005; Revised November 07, 2005

In a competition at Carnegie Mellon University, the mechanical engineering students designed and manufactured 27 heat sinks. The heat sinks were then tested for thermal performance in cooling a mock processor. A heat sink with three rows of 9, 8, and 9 dimpled rectangular fins in staggered configuration performed the best, while having the least total volume (about 25% less than the set value). Validation of the observed thermal performance of this heat sink by experimentation and numerical simulations has motivated the present investigation. Thermal performance of the heat sinks with and without dimples have been evaluated and compared. Results of both the measurements and simulations indicate that dimples do in fact improve heat transfer capability of the heat sinks. However, dimples cause more pressure drop in the air flow. Keeping the total volume of the heat sink and the height of the fins constant and changing the number of the fins and their arrangement show that there is an optimum number of fins for the best performance of the heat sink. The optimum fin numbers are different for inline and staggered arrangements.

Copyright © 2006 by American Society of Mechanical Engineers
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Figure 1

Results from the tests of 28 heat sinks including the one that is being tested as the lab experiment

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Figure 2

Heat sink number 28 which performed the best with a total volume of about 25% below the limit (110cm3)

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Figure 3

Example of the measured data curve fitting. The heat transfer coefficient h is determined by finding the best curve fit and is accurate within ±15%. The thermocouples were individually calibrated with accuracies better than ±0.1°C.

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Figure 4

The measured heat transfer coefficient for the individual fins of the dimple and plain heat sinks. The letters A, B, and C refer to fins in the first, second, and third row.

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Figure 5

Velocity distribution across the fin assembly as measured at three different heights and averaged

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Figure 6

The solution domain for the numerical simulation of the combined heat transfer in the air and in the heat sink

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Figure 7

Temperature distribution in the flowing air at the fins mid height for dimpled and plain staggered heat sinks

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Figure 8

Temperature distribution in the flowing air at the fins midheight for dimpled and plain inline heat sinks

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Figure 9

Temperature distribution in the air flowing over the inline bumped fins of the 999 heat sink

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Figure 10

Thermal resistance versus total pressure drop of the heat sinks

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Figure 11

A comparison of the velocity and temperature patterns for the staggered 989 heat sink with dimpled fins resulted from periodic boundary condition solutions with coarse and fine meshes

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Figure 12

Schematic of the fins with cylindrical dimple∕bump or dimple∕dimple




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