0
RESEARCH PAPERS

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

[+] Author and Article Information
M. K. Md Arshad

School of Microelectronic Engineering, Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), Pusat Pengajian Jejawi, 02600 Arau, Perlis, Malaysiamohd.khairuddin@kukum.edu.my

I. Ahmad

School of Electrical, Electronics and Systems, University Kebangsaan Malaysia (UKM), 43600 Bangi, Selangor, Malaysia

A. Jalar

School of Applied Physics, University Kebangsaan Malaysia (UKM), 43600 Bangi, Selangor, Malaysia

G. Omar

ON Semiconductor, SCG Industries (M) Sdn. Bhd. Lot 122, 70450 Senawang, Negeri Sembilan, Malaysia

U. Hashim

School of Microelectronic Engineering, Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), Pusat Pengajian Jejawi, 02600 Arau, Perlis, Malaysia

J. Electron. Packag 128(3), 246-250 (Nov 29, 2005) (5 pages) doi:10.1115/1.2229223 History: Received April 03, 2005; Revised November 29, 2005

This paper reports the effects of a multiple zincation process on the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topography and morphology of the appearance of the Al bond pad. In addition, by comprehension of the effects of the multiple zincation process, the study includes investigating the Al dissolution rate and adhesion strength between eutectic a 37Pb63Sn solder ball and an under bump metallurgy (UBM) interface. Scanning electron microscopy, energy dispersive x-ray, atomic force microscopy, focused ion beam, and an Intellectest STORM series FA1500 shear tester were used as analytical tools in this study. The results suggest that the first zincation process follows the contour of the initial bond pad. The second zincation produces a slightly better surface appearance with a smooth and fine Zn crystallite. The Zn crystallites become a continuous film with the deposits looking like an island formation after the third zincation. The smooth surface of the third zincation, as an effect of multiple zincation, is later transferred to Ni and Au surfaces. The smooth surface of the UBM leads to a better shear strength with only a minimum Al dissolved.

FIGURES IN THIS ARTICLE
<>
Copyright © 2006 by American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

Diagram depicting the experimental flow

Grahic Jump Location
Figure 2

Surface topography images (using AFM): (a) Initial bond pad, (b) first zincation, (c) first zinc removal, (d) second zincation, (e) second zinc removal, and (f) third zincation

Grahic Jump Location
Figure 3

Surface morphology images (using SEM): (a) Initial bond pad, (b) first zincation, (c) first Zn removal, (d) second zincation, (e) second Zn removal, and (f) third zincation

Grahic Jump Location
Figure 4

Surface morphology of the test condition: (a) 30s of first zincation, (b) 30s of second zincation, (c) 30s of third zincation, (d) 60s of first zincation, (e) 60s of second zincation, and (f) 60s of third zincation

Grahic Jump Location
Figure 5

Influence of zincation to Al thickness

Grahic Jump Location
Figure 6

Shear strength results of electroless Ni immersion Au (ENIG)

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In