Electronics Packaging Cooling: Technologies From Gas Turbine Engine Cooling

[+] Author and Article Information
M. Arik, R. S. Bunker

Thermal Systems Laboratory, General Electric Global Research Center, Niskayuna, NY 12309

J. Electron. Packag 128(3), 215-225 (Jun 16, 2005) (11 pages) doi:10.1115/1.2229219 History: Received February 01, 2005; Revised June 16, 2005

Heat transfer in turbomachinery has been well established due to the long history of research in the field. A vast amount of research has been devoted to obtain flow fields and regimes, heat transfer modes, surface effects, and heat transfer enhancement techniques. Since most of the flows are in the turbulent regime of air cooling, various heat transfer enhancements such as turbulators, pin fins, concavities, and lattice cooling have been investigated. The electronics industry has shown a rapid increase in the functionality, speed, and the density of transistors, leading to a large increase in the required heat transfer. Most of the flows are in the transitional regime. Heat sinks are the primary choice for thermal management in electronics systems. Enhancements in heat sinks have been limited to taller and tighter fin spacing, while decreasing the weight and the cost. Current state-of-the-art for heat sinks in electronics components is lacking in heat transfer enhancement technologies, which is common in turbine heat transfer practice. Therefore, the primary goal of this paper is to examine the turbomachinery cooling technologies and to inform the packaging engineers about the thermal technologies on the other side of the thermal world.

Copyright © 2006 by American Society of Mechanical Engineers
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Figure 1

Cooled high-pressure gas turbine

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Figure 2

A typical blade cooling circuit with turbulated passages

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Figure 3

Intended function of turbulators in the cooling channel

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Figure 4

Heat transfer coefficients at Re=50,000

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Figure 5

Heat transfer coefficients for turbulated passages

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Figure 6

Pin fin surface enhancements

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Figure 7

Nusselt number enhancements for both inline and staggered arrays

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Figure 8

Schematic diagram of the flow interaction with a single concavity

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Figure 9

Concavity heat transfer enhancement

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Figure 10

Typical vortex cooling

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Figure 11

Distribution of heat transfer coefficients of a vortex channel at various Re numbers

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Figure 12

Schematic diagram of a typical impingement array

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Figure 15

Combined surface enhancements: short pin fins combined with both turbulators and concavity arrays

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Figure 14

Variation of local Nusselt numbers for various flow and dimensionless impingement parameters

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Figure 13

Experimental heat transfer coefficients for a line of impingement cooling jets with average jet Re of 220,000, Z∕D=2.3, and 50% initial crossflow




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