0
RESEARCH PAPERS

Modeling of Natural Convection in Electronic Enclosures

[+] Author and Article Information
Peter M. Teertstra

Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering,  University of Waterloo, Waterloo, Ontario, N2L 3G1, Canadapmt@mhtlab.uwaterloo.ca

M. Michael Yovanovich, J. Richard Culham

Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering,  University of Waterloo, Waterloo, Ontario, N2L 3G1, Canada

J. Electron. Packag 128(2), 157-165 (Sep 28, 2005) (9 pages) doi:10.1115/1.2188953 History: Received November 10, 2004; Revised September 28, 2005

An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located at the center of an isothermal, cuboid shaped enclosure. A composite model is developed based on asymptotic solutions for three limiting cases: pure conduction, laminar boundary layer convection, and transition flow convection. The conduction shape factor and natural convection models are validated using data from CFD simulations for a wide range of enclosure geometries and flow conditions. The model is shown to be in good agreement, to within 10% RMS, with the numerical data for all test configurations.

Copyright © 2004 by IEEE
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Figure 1

Schematic of enclosure geometry

Grahic Jump Location
Figure 2

Composite model for enclosure convection

Grahic Jump Location
Figure 3

Composite model for conduction shape factor

Grahic Jump Location
Figure 16

Convection model validation: L∕W=2, Lo∕Li=1.6

Grahic Jump Location
Figure 4

CFD model solution domains: (a) Flotherm (13) conduction model; (b) Icepak (14) convection model

Grahic Jump Location
Figure 5

Grid convergence: Conduction simulations

Grahic Jump Location
Figure 6

Grid convergence: Convection simulations

Grahic Jump Location
Figure 7

Conduction shape factor model validation: L∕W=1

Grahic Jump Location
Figure 8

Conduction shape factor model validation: L∕W=2

Grahic Jump Location
Figure 9

Convection model validation: L∕W=1, Lo∕Li=1.05

Grahic Jump Location
Figure 10

Convection model validation: L∕W=1, Lo∕Li=1.2

Grahic Jump Location
Figure 11

Convection model validation: L∕W=1, Lo∕Li=1.6

Grahic Jump Location
Figure 12

Convection model validation: L∕W=1, Lo∕Li=2.0

Grahic Jump Location
Figure 13

Convection model validation: L∕W=0.5, Lo∕Li=1.2

Grahic Jump Location
Figure 14

Convection model validation: L∕W=0.5, Lo∕Li=1.6

Grahic Jump Location
Figure 15

Convection model validation: L∕W=2, Lo∕Li=1.2

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In