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ERRATUM

Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298] OPEN ACCESS

[+] Author and Article Information
Mudasir Ahmad, Ken Hubbard, Mason Hu

J. Electron. Packag 128(1), 98 (Mar 01, 2006) (1 page) doi:10.1115/1.2165648 History:
FIGURES IN THIS ARTICLE

Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised.

Copyright © 2006 by American Society of Mechanical Engineers
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