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RESEARCH PAPERS

Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

[+] Author and Article Information
Jong-Jin Park

Center for Intelligent Materials and Systems, Department of Mechanical Engineering, University of Washington, Box 352600, Seattle, WA 98195-2600parkjj@u.washington.edu

Minoru Taya

Center for Intelligent Materials and Systems, Department of Mechanical Engineering, University of Washington, Box 352600, Seattle, WA 98195-2600tayam@u.washington.edu

J. Electron. Packag 128(1), 46-52 (Sep 23, 2005) (7 pages) doi:10.1115/1.2159008 History: Received September 26, 2004; Revised September 23, 2005

A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tungsten (TiW) layers, gold layers, and thin alumina layers. Then the measured thermal conductivity of the TIM was compared with predictions made by the thermal resistor network model, and the experimental results were found to be consistent with the predictions made by the model.

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Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic diagrams: (a) 1D heat flow, and (b) two alumina substrates and specimen

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Figure 2

A new apparatus: (a) photo of the alumina substrate, and (b) cross-sectional view of the alumina substrate

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Figure 3

Scanning electron microscopy (SEM) photos: (a) carbon nanotubes, (b) carbon nanotubes and matrix

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Figure 4

Electrical resistance vs temperature

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Figure 5

Experimental setup: (a) photo of experimental setup, and (b) a schematic sketch

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Figure 6

Thermal interface impedance of the apparatus

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Figure 7

Thermal resistor model: (a) thermal resistor network in a 3D simple cubic lattice system viewed by a 2D section, (b) resistors of unit cube, and (c) thermal resistance of two resistors

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Figure 8

Computation procedure of thermal resistor network model

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Figure 9

Thermal conductivity calculated by resistor network model and measured by the apparatus; (a) step 1; thermal conductivity of matrix+solvent, and (b) step 2; thermal conductivity of the composite

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