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RESEARCH PAPERS

Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications

[+] Author and Article Information
Jaeseon Lee

 Purdue University International Electronic Cooling Alliance, West Lafayette, IN 47907

Issam Mudawar1

 Purdue University International Electronic Cooling Alliance, West Lafayette, IN 47907mudawar@ecn.purdue.edu

1

Author to whom correspondence should be addressed.

J. Electron. Packag 128(1), 30-37 (Jun 17, 2005) (8 pages) doi:10.1115/1.2159006 History: Received September 07, 2004; Revised June 17, 2005

While most recently electronic cooling studies have been focused on removing the heat from high-power-density devices, the present study also explores means of greatly decreasing the device operating temperature. This is achieved by incorporating a microchannel heat sink as an evaporator in an R134a refrigeration loop. This system is capable of maintaining device temperatures below 55°C while dissipating in excess of 100Wcm2. It is shown that while higher heat transfer coefficients are possible with greater mass velocities, those conditions are typically associated with wet compression corresponding to evaporator exit quality below unity and liquid entrainment at the compressor inlet. Wet compression compromises compressor performance and reliability as well as refrigeration cycle efficiency and therefore must be minimized by maintaining only slightly superheated conditions at the compressor inlet, or using a wet-compression-tolerant compressor. A parametric study of the effects of channel geometry on heat sink performance points to channels with small width and high aspect ratio as yielding superior thermal performance corresponding to only a modest penalty in pressure drop.

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Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of test loop

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Figure 2

Structure of microchannel evaporator test section

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Figure 3

Pictures of facility and key components

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Figure 4

Channel unit cell geometry

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Figure 5

Variation of measured copper temperature with mass velocity for evaporator heat loads of (a) 100, (b) 150, (c) 200, and (d) 500W

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Figure 6

Pressure-enthalpy (P-h) diagram for two evaporator mass velocities

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Figure 7

Variation of cycle COP with mass velocity for three evaporator heat loads

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Figure 9

Variations of mean micro-channel base temperature and pressure drop with (a) hydraulic diameter and (b) channel aspect ratio

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Figure 10

(a) Variations of hydraulic diameter and aspect ratio with channel width for constant channel height. (b) Variations of mean channel base temperature and pressure drop with channel width for constant channel height.

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Figure 8

Predicted variations of quality, two-phase heat transfer coefficient, and channel base temperature along the microchannel for evaporator heat load of 200W and mass velocities of (a) 199, (b) 163, and (c) 128kg∕m2s

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