State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

[+] Author and Article Information
K. M. Jansen, V. Gonda

 Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands

L. J. Ernst

 Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlandsl.j.ernst@wbmt.tudelft.nl

H. J. Bressers

 Philips, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

G. Q. Zhang

 Philips, P.O. Box 218, 5600 MD Eindhoven, The Netherlandsg.q.zhang@philips.com

J. Electron. Packag 127(4), 530-536 (Dec 22, 2004) (7 pages) doi:10.1115/1.2070092 History: Received February 24, 2004; Revised December 22, 2004

In microelectronic industry, thin polymer layers are one of the more commonly used product constituents. Examples are glue layers, coatings, and dielectric layers. The thicknesses of these films vary from a few tens of nanometers to over a hundred micrometers. Since at film thicknesses below 100nm the thermal and mechanical properties start to deviate from those in the bulk, adequate characterization techniques are required. In the present paper we will report the results of an extensive literature search on the state-of-the-art of thermo-mechanical thin film characterization methods, such as the substrate curvature test, nanoindentation technique, bulge test, and impulsive stimulated thermal scattering.

Copyright © 2005 by American Society of Mechanical Engineers
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Figure 1

Setup for curvature measurement

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Figure 2

In situ measurement of film thickness and bending curvature (17)

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Figure 3

Loading and unloading curve of a nanoindentation experiment

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Figure 4

Schematic representation of indentation

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Figure 5

Deflection of a film in a bulge test

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Figure 6

Deflection measurement by interferometry

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Figure 7

Acoustic wave propagation directions

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Figure 8

Schematic diagram of ISTS experiment




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