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RESEARCH PAPERS

A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block

[+] Author and Article Information
S. Kong Wang1

Department of Mechanical Engineering, I-Shou University, Taiwan, Republic of chinaskwang@isu.edu.fw

Tzu-Chen Hung

Department of Mechanical Engineering, I-Shou University, Taiwan, Republic of china

Bau-Shi Pei

Department of Engineering and System Science, National Tsing-Hwa University, Taiwan, Republic of China

An-Fong Chen, Ja-Lin Du

Department of Mechanical Engineering, I-Shou University, Taiwan, Republic of China

1

To whom correspondence should be addressed.

J. Electron. Packag 127(4), 523-529 (May 03, 2005) (7 pages) doi:10.1115/1.2070089 History: Received August 17, 2004; Revised May 03, 2005

Two-dimensional convection heat transfer on a chip with a flow-disturbing obstruction block above it, as induced by natural coupling between flow and structure, was investigated numerically. The effects of various induced trajectories of the obstruction block on chip cooling were investigated. A numerical algorithm PISO , a conjugate heat transfer scheme for fluid-solid thermal interactions with moving grids was used to solve a coupled system of governing equations. The study shows that the induced trajectories of the obstruction block, as a result of natural coupling between the block and the flow, have a noticeable impact on chip cooling. The present study successfully simulated the motion of an obstruction block on a heated chip and the associated “lock-in” phenomenon due to natural coupling. When lock-in occurs, the trajectory of the block movement follows the shape of an oval. If this occurs, the cross-stream movement is much larger than the stream-wise movement. Passively induced disturbance of the flow field for the case with a large oval trajectory yields an enhancement of heat dissipation from the chip. In general, the vibration of the block as induced by an unbalanced pressure field around the chip would disturb the thermal boundary above the chip. Hence, the induced vibration enhances heat dissipation from the chip. It is concluded in this study that a vibrating obstruction block with a lock-in mode of oscillation is a vital condition for achieving an enhancement of heat dissipation as can be observed by an increase of Nusselt number on the chip top surface.

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Copyright © 2005 by American Society of Mechanical Engineers
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References

Figures

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Figure 2

Vertical movement of obstruction block vs grid scheme

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Figure 3

Effect of damping ratio on block trajectories

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Figure 4

Effect of block mass on block trajectories

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Figure 5

Locations on chip upper surface

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Figure 6

Average temperatures on the upper surface of the chip

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Figure 7

Variation of chip temperature (a) at the center of the chip and (b) at point A

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Figure 8

Variation of chip temperature (a) at point B, and (b) at point C

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Figure 9

Flow field of the ambient air

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Figure 10

Contours of constant temperatures of the ambient fluid for case 3

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Figure 11

Average Nusselt numbers on the chip

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Figure 1

Numerical modeling and grids of chip-block system

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