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RESEARCH PAPERS

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

[+] Author and Article Information
B. L. Chen, G. Y. Li

School of Materials Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 639798

X. Q. Shi, K. H. Ang, Jason P. Pickering

 Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075

J. Electron. Packag 127(4), 466-473 (Feb 24, 2005) (8 pages) doi:10.1115/1.2056574 History: Received April 30, 2004; Revised February 24, 2005

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

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Copyright © 2005 by American Society of Mechanical Engineers
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Figures

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Figure 1

RTC experimental setup

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Figure 2

(a) Simulation results of RTC temperature distribution at 100°C and (b) temperature profile for points A–D

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Figure 3

Temperature loading profile for (a) RTC test and (b) ATC test

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Figure 4

Cross-sectional SEM view of a solder joint after failure (a) ATC and (b) RTC test

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Figure 5

Cross-sectional SEM view of a solder joint failed with a prevoid at the corner

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Figure 6

Two-parameter Weibull plots of ATC and RTC test failure data

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Figure 7

Three-parameter Weibull plot of ATC and RTC test failure data

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Figure 8

Failure rate plot for ATC and RTC testings

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Figure 9

One-eighth finite element model of the TBGA package

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Figure 10

ATC inelastic contour plot

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Figure 11

RTC inelastic contour plot

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