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RESEARCH PAPERS

Moisture Absorption and Diffusion Characterization of Molding Compound

[+] Author and Article Information
Xu Chen1

School of Chemical Engineering and Technology,  Tianjin University, Tianjin 300072, People’s Republic of China

Shufeng Zhao

School of Chemical Engineering and Technology,  Tianjin University, Tianjin 300072, People’s Republic of China

Linda Zhai

 Freescale Semiconductor Inc., Tianjin 300072, People’s Republic of China

1

Corresponding author. Tel: 86-22-27408399 Fax: 86-22-87893037 e-mail: xchen@eyou.com

J. Electron. Packag 127(4), 460-465 (Jan 21, 2005) (6 pages) doi:10.1115/1.2065707 History: Received October 01, 2004; Revised January 21, 2005

The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed to the occurrence of the second phase, and the Fick’s Law can be modified by diffusion coefficient varying with the moisture concentration. The predicted value by the modified Fick’s Law agrees with the test data. At certain temperature, the saturated moisture content of molding compound is proportional to the relative humidity, and the proportional factor is the product of solubility and saturated vapor pressure. The solubility is a physical characteristic, which has no relations with the relative humidity of ambient air.

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Copyright © 2005 by American Society of Mechanical Engineers
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Figures

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Figure 1

Comparison of the approximate function and theoretical function

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Figure 2

Test data and Fickian curve of moisture absorption of molding compound MP8000

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Figure 3

Test data and Fick’s curve of moisture absorption of molding compound CEL9220M

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Figure 4

Relation between diffusion coefficient and average moisture content, (a) MP8000 at 85°C∕85%RH;(b) MP8000 at 85°C∕60%RH;(c) CEL9220M at 85°C∕85%RH;(d) CEL9220M at 85°C∕60%RH

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Figure 5

The moisture distribution along the thickness of the infinite plate (MP8000, 85°C∕85%RH)

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Figure 6

The numerical result of MP8000 while D is not constant

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Figure 7

The numerical result of CEL9220M while D is not constant

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