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RESEARCH PAPERS

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

[+] Author and Article Information
Ming-Hwa R. Jen1

Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, 70 Lien-hai Road, Kaohsiung 804, Taiwan, Republic of Chinajmhr@mail.nsysu.edu.tw

Lee-Cheng Liu

Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, 70 Lien-hai Road, Kaohsiung 804, Taiwan, Republic of China

Jenq-Dah Wu

 Process Engineering Division, Advanced Semiconductor Engineering, Inc., 2F, 21, Kai Fa Road, 811, Nantze Export Processing Zone, Kaohsiung, Taiwan, Republic of Chinajd wu@asek.asetwn.com.tw

1

To whom correspondence should be addressed.

J. Electron. Packag 127(4), 446-451 (Jan 13, 2005) (6 pages) doi:10.1115/1.2070090 History: Received August 17, 2004; Revised January 13, 2005

The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tinAlNiVCu Under bump metallization (UBM) and packages of pure tinAlNiVCu UBM/substrate of standard thickness of aurum. The mechanical properties under multiple reflow and long term high temperature storage test (HTST) tests at different temperatures and the operational life were obtained. A scanning electron microscope was used to observe the growth of IMC and the failure modes in order to realize their reaction and connection. From the empirical results of bare dies, the delamination between IMC and die was observed due to the tests at 260 °C multiple reflow. However, their mechanical properties were not affected. Nevertheless, the bump shear strength of bare dies were decreased by HTST tests. In package, all the results of mechanical properties by multiple reflow test and HTST test were significantly lowered. It was shown that the adhesion between bump and die reduced obviously as tests going on. As for high temperature operational life test in the conditions of 150 °C and 320 mA (5040Acm2), the average stable service time of the package was 892 h, and the average ultimate service time of the package was 1053 h.

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Copyright © 2005 by American Society of Mechanical Engineers
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Figures

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Figure 1

The scheme of failure modes

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Figure 2

IMC growth of 260 °C multiple reflow test in bare die (a) as-received, (b) 5× reflow, (c) 10× reflow, (d) 20× reflow, (e) 30× reflow

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Figure 3

IMC growth of 260 °C multiple reflow test in package (a) as-received, (b) 5× reflow, (c) 10× reflow, (d) 20× reflow, (e) 30× reflow

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Figure 4

IMC growth of 150 °C HTST test in package (a) as-received, (b) 24, (c) 100, (d) 300, (e) 500, (f) 1000, (g) 2000 h

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Figure 5

The definition of service time of the package HTOL test

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