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RESEARCH PAPERS

Design of Micro-Temperature Sensor Array With Thin Film Thermocouples

[+] Author and Article Information
Jong-Jin Park

Center for Intelligent Materials and Systems, Department of Mechanical Engineering,  University of Washington, Box 352600, Seattle WA 98195-2600parkjj@u.washington.edu

Minoru Taya

Center for Intelligent Materials and Systems, Department of Mechanical Engineering,  University of Washington, Box 352600, Seattle WA 98195-2600tayam@u.washington.edu

J. Electron. Packag 127(3), 286-289 (Aug 04, 2004) (4 pages) doi:10.1115/1.1997157 History: Received March 04, 2004; Revised August 04, 2004

We are in the process of developing a micro-temperature sensor array with T-type (copper–constantan) thin film thermocouples (TFTCs) to measure the chip temperature distribution of electronic packages. A thin aluminum nitride (AlN) layer of 100 nm thickness was deposited on a silicon substrate. AlN acts not only as an electrical insulator but also as a thermal conductor between the silicon substrate and thin film thermocouples. Copper thin film with a thickness of 50 nm and constantan thin film with the same thickness were deposited on the AlN layer. The sensor array has 10×10 junctions within a 9mm×9mm area, and each junction covers a 100μm×100μm area. Electro-thermal forces measured by TFTCs using one-dimensional steady-state heat conduction were compared with the electro-thermal forces measured by standard thermocouples, and the difference between the Seebeck coefficients of the copper material and the constantan thin film was calculated according to these measurements. In order to verify the sensor array, it was placed under two-dimensional steady-state heat conduction, and electro-thermal forces were measured and converted to temperatures. Finite element analysis simulation results were compared with the temperatures, and with experimental measurements were found to be in agreement with the simulated values.

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Copyright © 2005 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic diagram of thermocouples; (a) 2 materials, and (b) 3 materials

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Figure 2

Design of thin film thermocouples 10×10 junctions; (a) micro temperature sensor array of 9mm×9mm (b) specimen of 75mm×55mm

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Figure 3

Experimental setup of 1-D heat flow; (a) photo and (b) schematic diagram

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Figure 4

Location of heat source (solid line) and heat sink (dotted line); (a) 1-D steady-state heat conduction, and (b) 2-D steady-state heat conduction

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Figure 5

Electro-thermal force of 1-D steady-state heat conduction; (a) 3-D graph, (b) distance vs electro-thermal force

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Figure 6

Temperatures of 2-D steady-state heat conduction; (a) simulation results, and (b) experimental measurements

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