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RESEARCH PAPERS

Dynamics Of Board-Level Drop Impact

[+] Author and Article Information
E. H. Wong

School of Aerospace, Mechanical and Mechatronic Engineering, Centre for Advanced Materials Technology, University of Sydney, Sydney, Australiaeehua.wong@aeromech.usyd.edu.au

J. Electron. Packag 127(3), 200-207 (Jul 17, 2004) (8 pages) doi:10.1115/1.1938987 History: Received May 10, 2004; Revised July 17, 2004

The dynamic response of the printed circuit board (PCB) in a standard board-level drop impact test has been modeled as a spring-mass system, a beam, and a plate. Analytical solutions for the time-response and amplification of the deflection, bending moment, and acceleration at any point on the PCB have been developed and validated with finite element analysis. The analyses have shown that (i) the response of the PCB was dominated by the fundamental mode and (ii) the response of the PCB depends heavily on the ratio between the frequency of the PCB and the input acceleration pulse. The bending moment on the PCB has been shown beyond doubt to be responsible for the interconnection stress; the maximum moment on the PCB can be most effectively reduced through reducing the PCB thickness. The rapid receding of the higher modes in the moment response suggests that it can be adequately and effectively modeled using the standard implicit time-integration code.

Copyright © 2005 by American Society of Mechanical Engineers
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References

Figures

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Figure 1

A typical drop impact test setup

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Figure 2

(a) PCB modeled as a single spring-mass system (b) input acceleration pulse

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Figure 3

Acceleration-time response for the spring-mass model

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Figure 4

Maxima response spectrum and the associated time

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Figure 5

Beam model and the coordinate system

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Figure 6

Deflection-time response at midlength of the beam for Rω1 equals to (a) 0.1 and (b) 0.2

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Figure 7

Bending moment-time response at midlength of beam for Rω1 equals to (a) 0.1 and (b) 0.2

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Figure 8

Acceleration-time response at midlength of beam for Rω1 equals to (a) 0.2 and (b) 0.3

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Figure 9

Acceleration—FEA versus analytical beam model

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Figure 10

Response spectrum for (a) deflection, (b), bending moment, and (c) acceleration

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Figure 11

Beam to spring-mass analogy

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Figure 12

Plate model and the coordinate system (simply supported on four edges)

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Figure 13

Deflection-time response at middle of plate for Rω1 equals to (a) 0.1 and (b) 0.2

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Figure 14

Bending moment-time response at middle of plate for Rω1 equals to (a) 0.1 and (b) 0.4

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Figure 15

Acceleration-time response at middle of plate for Rω1 equals to (a) 0.3 and (b) 0.4

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Figure 16

Acceleration- and moment-FEA versus analytical plate model

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Figure 17

Response spectrum for (a) deflection, (b) bending moment, and (c) acceleration

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Figure 18

FEA corner-support versus analytical edge-support solution (a) deflection, (b) moment, and (c) acceleration

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Figure 19

Response spectrum of corner-support and edge-support plate

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Figure 20

PCB bending moment versus interconnection stress

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Figure 21

Experimental correlation between PCB moment and interconnection stress

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Figure 22

Parametric study for PCB moment

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Figure 23

Velocity impact–spring-mass model

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