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TECHNICAL BRIEF

Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

[+] Author and Article Information
X. K. Sun, X. J. Xin

 Department of Mechanical and Nuclear Engineering, Kansas State University, Manhattan, Kansas 66506

Z. J. Pei

 Department of Industrial and Manufacturing Systems Engineering, Kansas State University, Manhattan, Kansas 66506 zpei@ksu.edu

J. Electron. Packag 127(2), 189-192 (May 04, 2004) (4 pages) doi:10.1115/1.1869510 History: Received September 03, 2003; Revised May 04, 2004

This paper presents an assessment of four die-strength testing configurations using finite element analysis. The simulation indicates that ring-on-ring configuration is the best because it generates a uniform stress field on a large die surface area. The four-point-bend configuration ranks second and the three-point-bend configuration is third. The pin-on-ring configuration is the worst because the stress gradient is severe in the central region. To minimize uncertainty in the loading positions, it is advised that loading rings or bars with small radii be used.

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Copyright © 2005 by American Society of Mechanical Engineers
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Figures

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Figure 1

Four testing configurations

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Figure 2

Three-dimensional FEA meshes: (a) ring-on-ring; (b) pin-on-ring; (c) four-point-bend; and (d) three-point-bend

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Figure 3

Von Mises stress contours (in MPa) on the bottom surface of the ring-on-ring specimen

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Figure 4

Von Mises stress contours (in MPa) on the bottom surface of pin-on-ring test specimen

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Figure 5

Von Mises stress contours (in MPa) on the bottom surface of four-point-bend specimen

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Figure 6

Von Mises stress contours (in MPa) on the bottom surface of three-point-bend specimen

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