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RESEARCH PAPERS

Yield Function for Solder Elastoviscoplastic Modeling

[+] Author and Article Information
M. Dube, T. Kundu

 Department of Civil Engineering and Engineering Mechanics, University of Arizona, Tucson, AZ 85721, USA

J. Electron. Packag 127(2), 147-156 (Sep 14, 2004) (10 pages) doi:10.1115/1.1869514 History: Received October 13, 2003; Revised September 14, 2004

Field reliability extrapolations from accelerated tests necessitate simulation of a variety of material behaviors under general loading conditions. The Hierarchical Incremental Single Surface (HiSS) yield function (Desai, C. S., 2001, Mechanics of Materials and Interfaces: The Disturbed State Concept, CRC Press, Boca Raton, FL.) has been applied extensively to a wide range of materials, from solders and silicon to ceramics and geotechnical materials, for simulating continuous-yield elastoplastic and elastoviscoplastic behavior. This work presents a continuous-yield function that avoids problems with HiSS for thermal and tensile loading. Validations are presented for eutectic PbSn data of Wang (Wang, Z., Desai, C.S., and Kundu, T., 2001, “Disturbed State Constitutive Modeling and Testing of Joining Materials in Electronic Packaging,” report to NSF for Materials Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed.

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Copyright © 2005 by American Society of Mechanical Engineers
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Figures

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Figure 1

HiSS-δ0 yield function with discontinuous yield along O–A in shaded region

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Figure 2

Changing temperature from T1 to T2, and back to T1 moves the initial yield surface from S1 to S2 to S3 for HiSS. Material remains at zero stress, plastic strain changes from ξ0(T1) to ξ0(T2)[>ξ0(T1)]

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Figure 3

Proposed yield function starting at origin

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Figure 4

Elastoplastic backpredictions: (a) temperature=−20°C, (b) temperature=25 °C, (c) temperature=75 °C, and (d) temperature=125 °C

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Figure 5

Elastoviscoplastic backpredictions: (a) temperature=−20°C, (b) temperature=25 °C , (c) temperature=75 °C, and (d) temperature=125 °C

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Figure 6

Effects of unconstrained cooling and heating: (a) total axial strain upon unconstrained cooling from 125 °C (CTE from Pan (58)); (b) yield stress at 125 °C versus prior cooling temperature

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Figure 7

Elastoplastic static yield surface HiSS backpredictions at 125 °C for various “storage” temperatures showing spurious thermal-history dependence for HiSS (a) improved HiSS parameters (HISS-IP); (b) original parameters (HISS)

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