Submodeling Analysis for Path-Dependent Thermomechanical Problems

[+] Author and Article Information
Tong Hong Wang

 Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan

Yi-Shao Lai

 Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwanyishao_lai@aseglobal.com

J. Electron. Packag 127(2), 135-140 (Sep 28, 2004) (6 pages) doi:10.1115/1.1869513 History: Received September 22, 2003; Revised September 28, 2004

In a finite element analysis, when localized behavior of a large model is of particular concern, generally one would refine the mesh until it captures the local solution adequately. Submodeling is an alternative way for solving this kind of problem. It provides a relatively accurate solution at a modest computational cost. For a valid submodeling analysis, the boundaries of the submodel should be sufficiently far away from local features so that St. Venant’s principle holds. Moreover, special treatments are required for solving problems that involve path-dependent characteristics. This paper presents a general procedure to perform submodeling analyses for path-dependent thermomechanical problems without a priori assumptions on the structural response. The procedure was benchmarked using a bimaterial strip and demonstrated through analyses on a bump chip carrier package assembly. The procedure is conducive to the numerical assessment of fatigue lives of electronic packages.

Copyright © 2005 by American Society of Mechanical Engineers
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Figure 6

Cross section of a soldered terminal

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Figure 7

The global model (left) and the close-up view of the terminals (right)

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Figure 8

The submodel (left) and the detailed structure for the terminal (right)

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Figure 1

Finite element meshes for the global model and the submodel

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Figure 2

Deflection versus time

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Figure 3

Hysteresis loops of shear stress versus plastic shear strain

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Figure 4

Viscoplastic strain energy density versus time

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Figure 5

Terminal layout of the package (unit: mm)



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