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RESEARCH PAPERS

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

[+] Author and Article Information
W. K. Chiang, Y. C. Chan

Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 127(2), 113-119 (Jun 03, 2005) (7 pages) doi:10.1115/1.1849236 History: Received August 03, 2003; Revised June 13, 2004; Online June 03, 2005
Copyright © 2005 by ASME
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References

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Figures

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Silicon chip with daisy-chained bumps
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Conductive particle structure
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Pictorial view of ACF bonding assembly
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Four point probe (FPP) test
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Results of glass transition temperature (Tg)
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Results of FTIR: (a) raw ACF, (b) cured ACF (as bonded), and (c) cured ACF+500 h humidity aging
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Surface morphology of raw ACF
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Surface morphology of cured ACF
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Surface morphology of cured ACF+500 h of humidity aging
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Contact resistance versus different reflow profiles
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Open joint percentage versus different reflow profiles
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Results of contact resistance versus humidity aging
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Results of contact resistance after reflow process (220°C)
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Results of open joint failure after reflow process (220°C)
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Cross section of an aged ACF joint (500 h of humidity aging) with reflow treatment

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