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RESEARCH PAPERS

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

[+] Author and Article Information
John Lau

Agilent Technologies, Inc. 5301 Stevens Creek Blvd., Santa Clara, CA 95052

Walter Dauksher

Agilent Technologies, Inc. 4380 Ziegler Rd., Fort Collins, CO 80525

J. Electron. Packag 127(2), 96-105 (Jun 03, 2005) (10 pages) doi:10.1115/1.1846069 History: Revised May 17, 2004; Received October 24, 2004; Online June 03, 2005
Copyright © 2005 by ASME
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References

Mann, N., Schafer, R., and Singpurwalla, N., 1974, Methods for Statistical Analysis of Reliability and Life Data, Wiley, New York.
Barlow, R., and Proschan, F., 1974, Statistical Theory of Reliability and Life Testing, Holt, Reinhart and Winston, New York.
Little, R., and Jebe, E., 1975, Statistical Design of Fatigue Experiments (Applied Science).
Smetana, J., Horsley, R., Lau, J., Snowdon, K., Shangguan, D., Gleason, J., Memis, I., Love, D., Dauksher, W., and Sullivan, B., 2003, “Lead-Free Design, Materials, and Process of High Density Packages,” Proc. APEX, Anaheim, CA, CD-ROM.
Lau, J., Dauksher, W., Smetana, J., Horsley, R., Shangguan, D., Castello, T., Memis, I., Love, D., and Sullivan, B., 2003, “Design for Lead-Free Solder Joints Reliability of High-Density Packages,” Proc. APEX, Anaheim, CA, CD-ROM.
Lau, J., Hoo, N., Horsley, R., Smetana, J., Shangguan, D., Dauksher, W., Love, D., Menis, I., and Sullivan, B., 2003, “Reliability Test and Data Analysis of High-Density Packages’ Lead-Free Solder Joints,” Proc. APEX, Anaheim, CA, CD-ROM.
Lau, J., Shangguan, D., Castello, T., Horsley, R., Smetana, J., Dauksher, W., Love, D., Memis, I., and Sullivan, B., 2003, “Failure Analysis of High-Density Packages’ Lead-Free Solder Joints,” Proc. APEX, Anaheim, CA, CD-ROM.
ANSYS, User’s Manual, Release 6.1, 2002.
Vianco, P., and Rejent, J., 2002, “Compression Deformation Response of 95.5Sn-3.9Ag-0.6Cu Solder,” UCLA Lead-Free Workshop.
Lau, J. H., Dauksher, W., and Vianco, P., 2003, “Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders,” IEEE Proc. Electronic Components & Technology Conference, pp. 229–236.
Lau, J. H., and Pao, Y., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
Morrow, J., 1965, “Cyclic Plastic Strain Energy and Fatigue of Metals,” ASTM STP-378, pp. 45–87.
Lau,  J. H., Mei,  Z., Pang,  S., Amsden,  C., Rayner,  J., and Pan,  S., 2002, “Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch,” ASME Trans., J. Electron. Packaging,124, pp. 403–410.
Cole, M., DeSousa, I., Interrante, M., Jozwiak, J., June, M., Martin, G., Milkovich, C., Ross, J., and Shannon, M., 2001, “The New Millennium for CCGA—Beyond 2000 I/O,” Proc. SMI, Chicago, IL, pp. 297–306.
Caulfield, T., Cole, M., Cappo, F., Zitz, J., and Benenati, J., 1995, “An Overview of Ceramic Ball and Column Grid Array Packaging,” in Ball Grid Array Technology, J. Lau, ed., McGraw-Hill, New York, pp. 131–169.
Banks, D., Hoebener, K., and Viswanadham, P., 1995, “Ceramic Ball Grid Array Assembly,” in Ref. 2, pp. 171–192.
Master, R., Cole, M., and Martin, G., 1995, “Ceramic Column Grid Array for Flip Chip Applications,” IEEE Proc. Electronic Components & Technology Conference, pp. 925–929.
Ray, S. et al., 1997, “Ceramic Column Grid Array for a High Performance Workstation Application,” IEEE Proc. Electronic Components & Technology Conference, pp. 319–324.
Ray, S. et al., 1999, “CLASP Ceramic Column Grid Array Technology for Flip Chip Carriers,” Proc. SEMICON West, pp. 1–7.
Interrante, M. J. et al., 2002, “High Density Column Grid Array Connections and Method Thereof,” US Patent No. 6,429,388.

Figures

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Dimensions and pin-out of the 1657CCGA
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Median rank failure data as a function of Weibull fit
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Comparison of two- and three-parameter Weibull life distributions
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90% confidence failure data
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The finite element model
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Detail of the refined mesh
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The moduli of the solders
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Vertical displacement of the substrate tip (eutectic fillets at the PCB)
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Vertical displacement of the substrate tip (lead-free fillets at the PCB)
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Maximum creep shear strain at the PCB side of the outermost column with eutectic PCB fillets
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Maximum creep shear strain at the PCB side of the outermost column with lead-free PCB fillets
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Creep shear strain in the outermost column with eutectic PCB fillets and subject to a temperature range of 0 to 100°C at 14 400 s
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Creep shear strain in the outermost column with lead-free PCB fillets and subject to a temperature range of 0 to 100°C at 14 400 s
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Maximum shear stress at the PCB side of the outermost column with eutectic PCB fillets
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Maximum shear stress at the PCB side of the outermost column with lead-free PCB fillets
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Shear stress in the outermost column with eutectic PCB fillets and subject to a temperature range of 0 to 100°C at 14 400 s
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Shear stress in the outermost column with lead-free PCB fillets and subject to a temperature range of 0 to 100°C at 14 400 s
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Cross section of the failed columns
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Hysteresis at the PCB side of the outermost column with eutectic PCB fillets
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Hysteresis at the PCB side of the outermost column with lead-free PCB fillets
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Critical strain energy density at the PCB side of the outermost column with eutectic PCB fillets
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Critical strain energy density at the PCB side of the outermost column with lead-free PCB fillets
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ΔW as a function of ΔT in the high lead column

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