Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

[+] Author and Article Information
Andrzej Mościcki, Tadeusz Sobierajski

 AMEPOX Microelectronics Ltd., Łódz, Poland

Jan Felba, Józef Kudzia

Faculty of Microsystems Electronics and Photonics,  Wrocław University of Technology, Poland

J. Electron. Packag 127(2), 91-95 (Nov 25, 2004) (5 pages) doi:10.1115/1.1899165 History: Received January 08, 2004; Revised November 25, 2004

Pb-free soldering and the use of electrically conducive adhesives in the electronics industry are a segment of the global trend towards a lead-free environment. In comparison to lead-free solders, current commercial isotropic conductive adhesives are characterized by lower conductivity and need much more time for curing. Usually, a few minutes at 150°C are enough only for precuring. In this paper we describe the developed family of formulations with a curing time of several seconds at 150°C. There are single-component formulations, solvent-free type, prepared in a special way on the base of the common, accessible resins. They have very convenient handling properties; e.g., no drying on open screen during printing process. Viscosity depends on the resin and may be intentionally changed. Shelf life for all these formulations is about 12months at room temperature in closed containers. Refrigeration is not necessary. Unfortunately, the material needs the highest quality and purity of electronic grade silver fillers. The total permitted level of impurities is estimated as less than 10ppm. However, this is, rather, an advantage of the silver-filled adhesives.

Copyright © 2005 by American Society of Mechanical Engineers
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Figure 1

Scanning electron microscope picture of silver flake filler

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Figure 2

Particle size distribution of silver flake filler

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Figure 3

Sample with four-point probe configurations

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Figure 4

Joint resistance vs curing time (150°C), for Y-type polymer+Fast catalyst (left) and X-type polymer+Slow catalyst (right)

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Figure 5

The main factorial effect of the C factor

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Figure 6

The main factorial effect of the A×B interaction




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