Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

[+] Author and Article Information
Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik

Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea

Suk-Jin Ham

MEMS Lab. Samsung Advanced Institute of Technology P.O. Box 111 Suwon 440-600 Korea

Soon-Bok Lee

CARE-Electronic Packaging Laboratory, Department of Mechanical Engineering Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea

J. Electron. Packag 127(2), 86-90 (Jun 03, 2005) (5 pages) doi:10.1115/1.1846062 History: Received January 06, 2004; Revised November 15, 2004; Online June 03, 2005
Copyright © 2005 by ASME
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Thermal and mechanical deformation of adhesive flip chip package during thermal cycling regime
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(a) Dimensional changes, and (b) modulus changes of cured ACFs as a function of temperature
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Moiré fringe patterns of ACF-A, ACF-B, and ACF-C assemblies. (a) U displacement field. (b) V displacement field
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Shear strain distributions of ACF layers along the center of chip
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Vertical deflection distributions along the center of chip
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Weibull lifetime plot of ACF flip chip packages when the failure criteria are (a) 50 mΩ and (b) 100 mΩ resistance increases
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Weibull lifetime plot of ACF-A flip chip packages with different DNP in thermal cycling testing. MTTF (Weibull life) is represented by the 63.2% in the Weibull function value.
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SAM images of (a) ACF-A, (b) ACF-B, and (c) ACF-C indicating the delamination between ACF layer and silicon die after 6200 cycles.




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