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RESEARCH PAPERS

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

[+] Author and Article Information
Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik

Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology Daejon 305-701, Korea

Suk-Jin Ham

MEMS Lab. Samsung Advanced Institute of Technology P.O. Box 111 Suwon 440-600 Korea

Soon-Bok Lee

CARE-Electronic Packaging Laboratory, Department of Mechanical Engineering Korea Advanced Institute of Science and Technology, Daejeon, 305-701, Korea

J. Electron. Packag 127(2), 86-90 (Jun 03, 2005) (5 pages) doi:10.1115/1.1846062 History: Received January 06, 2004; Revised November 15, 2004; Online June 03, 2005
Copyright © 2005 by ASME
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References

Liu,  J., 1995, “An Overview of Advances of Conductive Adhesive Joining Technology in Electronics Applications,” Mater. Technol., 10(11/12), pp. 247–252.
Yim, M. J., Paik, K. W., Kim, Y. K., and Hwang, H. N., 1997, “A Study on the Electrical Conduction Mechanism of Anisotropically Conductive Film for LCD Packaging Application,” in Advances in Electronic Packaging, EEP, New York, 19 (1), pp. 65–72.
Yim, M. J., Jeon, Y. D., and Paik, K. W., 1999, “Electroless Ni Bumped Flip Chip Interconnections on an Organic Substrate Using Anisotropic Conductive Adhesives Films (ACAs/ACFs),” in Extended Abstract in IMAPS Workshop on Flip Chip Technology, IMAPS, Atlanta, GA.
Post, D., Han, B., and Ifju, P., 1994, High Sensitivity Moiré, Springer, New York.
Han,  B., Guo,  Y., Lim,  C. K., and Caletka,  D., 1996, “Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods,” ASME Trans. J. Electron. Packag., 118, pp. 157–163.
Han,  B., 1998, “Recent Advancements of Moiré and Microscopic Moiré Interferometry for Thermal Deformation Analysis of Microelectronic Devices,” Exp. Mech., 38(4), pp. 278–288.
Pyland,  J., Pucha,  R. V., and Sitaraman,  S. K., 2002, “Thermomechanical Reliability of Underfilled BGA Packages,” IEEE Trans. Electron. Packag. Manuf., 25(2), pp. 100–106.

Figures

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(a) Dimensional changes, and (b) modulus changes of cured ACFs as a function of temperature
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Moiré fringe patterns of ACF-A, ACF-B, and ACF-C assemblies. (a) U displacement field. (b) V displacement field
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Shear strain distributions of ACF layers along the center of chip
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Vertical deflection distributions along the center of chip
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Weibull lifetime plot of ACF flip chip packages when the failure criteria are (a) 50 mΩ and (b) 100 mΩ resistance increases
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Weibull lifetime plot of ACF-A flip chip packages with different DNP in thermal cycling testing. MTTF (Weibull life) is represented by the 63.2% in the Weibull function value.
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SAM images of (a) ACF-A, (b) ACF-B, and (c) ACF-C indicating the delamination between ACF layer and silicon die after 6200 cycles.
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Thermal and mechanical deformation of adhesive flip chip package during thermal cycling regime

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