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RESEARCH PAPERS

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

[+] Author and Article Information
Slawomir Rubinsztajn, Donald Buckley, John Campbell, David Esler, Eric Fiveland, Ananth Prabhakumar, Donna Sherman, Sandeep Tonapi

General Electric Company Global Research Center 1 Research Circle, Niskayuna, NY 12309

J. Electron. Packag 127(2), 77-85 (Jun 03, 2005) (9 pages) doi:10.1115/1.1846067 History: Received January 13, 2004; Revised June 23, 2004; Online June 03, 2005
Copyright © 2005 by ASME
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References

Figures

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TEM of the thin film of the cured dispersion of FCS in epoxy resin
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Example of solder wetting and coalescence for experimental epoxy resins: (a) epoxy filled with 5μm fused silicon (b) unfilled epoxy (c) epoxy filled with nanosized FCS. Test done by heating to reflow temperature a covered glass slide containing resin and 25 mil eutectic solder balls.
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SEM images of the cross section of the sample A (Fig. 2).
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Effect of catalyst level on the cure profile of experimental NFU materials. Nonisothermal DSC at heating rate of 30°C/min.
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DMA data for experimental NFU-1A
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a-Volcano reflow profile; b-soak reflow profile
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x-ray analysis of the PB10 test die assembled with NFU (a) Commercial grade (b) NFU-1B
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Top view of a flip chip assembled with nano-filled NFU-1B
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C-SAM images of flip chips assembled with (a) commercial grade and (b) experimental grade NFU-1B
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Center dot dispense and modified line dispense patterns used in NFU assembly
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Cross-sectional view of the PB8 test die assembled with experimental NFU that was not optimized
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Cross-sectional view of the PB8 test die assembled with experimental NFU-1B
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C-SAM images of flip chips assembled with experimental nanofilled underfill GE-1B (a)-before being subjected to thermal shock. (b) After 500 cycles of thermal shock, (c) after 1000 cycles of thermal shock.
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Transparency of 6 μm films of experimental GE WLU resins.
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View of saw streets through B-stage underfill layer (a) before dice (b) after dicing operation
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Solder bump collapse after reflow (16A-flux only, 16B flux+GE-WLU)

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