An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

[+] Author and Article Information
Peter Rodgers

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742e-mail: rodgers@calce.umd.edu

Valérie Eveloy

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742 e-mail: veveloy.@calce.umd.edu

M. S. J. Hashmi

Dublin City University, School of Mechanical and Manufacturing Engineering, Dublin 9, Irelande-mail: saleem.hashmi@dcu.ie

J. Electron. Packag 127(1), 67-75 (Mar 21, 2005) (9 pages) doi:10.1115/1.1849234 History: Received June 29, 2003; Revised June 27, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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Component internal architecture for the three thermally enhanced 160-lead PQFP package types. (a) Package type I, board locations A,K, and F to I; (b) Package type II, board location J; (c) Package type III, board locations B to E, and L to O.
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Component-PCB numerical models. (a) Stage A PCB. (b) Stage B PCB, central stream-wise component row (F-J).
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Component numerical model, package type I
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Predicted flow field vectors at the leading edge of Stage B PCB, taken along the board central stream-wise axis (Plane X-X, Fig. 1). (a) SA; (b) Two-layer zonal k-ε; (c) SST k-ω.
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Comparison of measured and predicted component junction temperature rises between the individually and simultaneously powered configurations for the central stream-wise row components (F-J) on the Stage B PCB




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