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Article

Thermal Design and Optimization Methodology for Integrated Power Electronics Modules

[+] Author and Article Information
Ying Feng Pang, Elaine P. Scott

Department of Mechanical Engineering, Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061

Jonah Zhou Chen

The Bradley Department of Electrical and Computer Engineering, Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061

Karen A. Thole

Department of Mechanical Engineering, Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, VA 24061e-mail: thole@vt.edu

J. Electron. Packag 127(1), 59-66 (Mar 21, 2005) (8 pages) doi:10.1115/1.1849233 History: Received May 15, 2003; Revised July 26, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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References

Figures

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Overview of the software integration system
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IPEM model used in all thermal analyses: (a) Boundary conditions, (b) Details of the IPEM model, and (c) Positioning of components on heat sink
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Location of interest in IPEM for sensitivity and uncertainty analyses
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(a) initial (Design A) and (b) modified (Design B) IPEM model from electrical optimization with reduction in copper trace area (top ceramic layer not shown)
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Steady-state temperature distributions models (a) Design A and (b) Design B
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Maximum MOSFET temperature for Design B and 8 cases from parametric study in comparison to Design A results shown as baseline
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Trade-offs between electrical and thermal performance for different DBC ceramic thicknesses
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Effect of heat spreader thickness on maximum temperature of IPEM
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Steady-state temperature distributions for Cases 6 and 8
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Sensitivity coefficient of each critical input parameter on each of the critical output variable, Xij+
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Dimensionless sensitivity-uncertainty of each critical input parameter on each of the critical output variables, σpi
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Overall uncertainty for each critical output variable
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Cost comparison of 22581 mm2 DBC ceramic for different materials and thicknesses

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