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Article

Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

[+] Author and Article Information
K. K. Lee, S. C. Tan, Y. C. Chan

Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 127(1), 52-58 (Mar 21, 2005) (7 pages) doi:10.1115/1.1846068 History: Received January 13, 2004; Revised June 03, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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Figures

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Schematic diagram of the active side of the test chip (1.11×1.06 mm2 )
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Curing degree of UV curable ACAs after UV light activation under intensity of 120 mW/cm2 with epoxy and reference peaks at 789 and 1455 cm−1 at different exposure time
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Curing degree of UV curable ACAs with postcuring treatment at 150°C after 6 s UV light activation under different intensities (Set A, 40 mW/cm2 ; Set B, 80 mW/cm2 ; Set C, 120 mW/cm2 )
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Schematic diagram of shear test of a bonded specimen
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Shear result of the bonded specimens under 40 mW/cm2 UV light activation for 6 s at different postcuring treatment
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Shear result of the bonded specimens under 80 mW/cm2 UV light activation for 6 s at different postcuring treatment
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Shear result of the bonded specimens under 120 mW/cm2 UV light activation for 6 s at different postcuring treatment
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Curing degree of sheared specimens of different UV exposure and postcuring treatments
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(a), (b) and (c). Active sides of sheared test chips after undergoing 80 mW/cm2 UV light activation for 6 s and 150°C postcuring for 2, 6 and 10 min, respectively.
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(a), (b) and (c). SEM photos of Au bumps (B1) of the sheared test chips after undergoing 40, 80 and 120 mW/cm2 UV light activation for 6 s and 150°C postcuring treatment for 8 min.

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