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Article

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

[+] Author and Article Information
Man-Lung Sham, Jang-Kyo Kim

Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 127(1), 47-51 (Mar 21, 2005) (5 pages) doi:10.1115/1.1849232 History: Received March 09, 2004; Revised August 04, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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References

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Figures

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Bimaterial strip bending test configuration
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Fracture surfaces of (a) conventional underfill resin containing rigid silica particles and (b) no-flow underfill resin containing liquid rubber particles
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Schematic drawing of dynamic mechanical analyzer (DMA)
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Schematic model of the bimaterial strip
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Variations of flexural moduli of underfill resins and glass slide as a function of temperature
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Curvature changes of bimaterial strip specimen with conventional underfill at different temperatures
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Comparison of probe displacements between experiment and prediction for conventional underfill resin
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Comparison of residual stresses between experiment and prediction for conventional underfill resin
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(a) Changes in CTE with temperature and (b) comparison of probe displacement between experiment and prediction for no-flow underfill resin
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Comparison of residual stresses between experiment and prediction for no-flow underfill resin

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