0
Article

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

[+] Author and Article Information
Man-Lung Sham, Jang-Kyo Kim

Department of Mechanical Engineering, Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 127(1), 47-51 (Mar 21, 2005) (5 pages) doi:10.1115/1.1849232 History: Received March 09, 2004; Revised August 04, 2004; Online March 21, 2005
Copyright © 2005 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Bimaterial strip bending test configuration
Grahic Jump Location
Fracture surfaces of (a) conventional underfill resin containing rigid silica particles and (b) no-flow underfill resin containing liquid rubber particles
Grahic Jump Location
Schematic drawing of dynamic mechanical analyzer (DMA)
Grahic Jump Location
Schematic model of the bimaterial strip
Grahic Jump Location
Variations of flexural moduli of underfill resins and glass slide as a function of temperature
Grahic Jump Location
Curvature changes of bimaterial strip specimen with conventional underfill at different temperatures
Grahic Jump Location
Comparison of probe displacements between experiment and prediction for conventional underfill resin
Grahic Jump Location
Comparison of residual stresses between experiment and prediction for conventional underfill resin
Grahic Jump Location
(a) Changes in CTE with temperature and (b) comparison of probe displacement between experiment and prediction for no-flow underfill resin
Grahic Jump Location
Comparison of residual stresses between experiment and prediction for no-flow underfill resin

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In