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Article

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

[+] Author and Article Information
Liqiang Cao, Zonghe Lai, Johan Liu

Swedish Microsystem Integration Technology Centre (SMIT), and Division of Electronic Production, School of Mechanical Engineering, Chalmers University of Technology, SE-431 53 Möndal, Sweden

J. Electron. Packag 127(1), 43-46 (Mar 21, 2005) (4 pages) doi:10.1115/1.1846066 History: Received January 13, 2004; Revised November 10, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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References

Figures

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Water absorption at five temperature levels (100% RH, 1 atm)
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Water absorption at different pressure levels (100% RH)
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Adhesive fracture energy and peel strength after different reliability tests
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Fracture surface of sample before aging
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Fracture surface of sample after aging

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