PCR Microchip Array Based on Polymer Bonding Technique

Xiaomei Yu; Ting Li; Lin Hao; Dacheng Zhang

doi:10.1115/1.1849231

Journal of Electronic Packaging | Volume 127 | Issue 1 | Article

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PCR Microchip Array Based on Polymer Bonding Technique

Xiaomei Yu, Ting Li, Lin Hao and Dacheng Zhang

[+] Author and Article Information

Xiaomei Yu

Ting Li, Dacheng Zhang

Institute of Microelectronics, Peking University, Beijing 100871, China

Lin Hao

Department of Hematology, Peking University First Hospital, Beijing 100034, China

J. Electron. Packag 127(1), 38-42 (Mar 21, 2005) (5 pages) doi:10.1115/1.1849231 History: Received January 07, 2004; Revised July 22, 2004; Online March 21, 2005

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Fabrication processes of PCR microchip array. (a) 800 nm of SiO₂ and 150 nm of LPCVD Si₃N₄ were grown on silicon wafer. (b) First and second photolithographies. The SiO₂ both on channels and chambers and the Si₃N₄ on chambers were removed. (c) The silicon was etched in KOH solution. The etching depth is 150 μm. (d) After removing the SiO₂ on the surface of the channels, the silicon etching was carried out until the channel depth of 50 μm was reached. (e) The thin polymer layer was transferred to the silicon chip by the stamping technique. (f) The silicon chip and the glass cover were bonded together with the sandwich technique.

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A SEM photograph of the finished silicon chip array

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(a) Microscope photos of split glass cover bonded by photoresist. (b) Microscope photos of split silicon chip bonded by photoresist.

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(a) Microscope photo of a void-free bonded chip with polyimide as the intermediate layer. (b) Microscope photo of the split silicon chip with part of the polyimide left on the chip surface.

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Microscope photo of a void-free bonded chip with epoxy as the intermediate layer

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Detected Raman spectrum of fluorescence PCR performed on a chip with Taqman probes

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Yu X, Li T, Hao L, Zhang D. PCR Microchip Array Based on Polymer Bonding Technique. ASME. J. Electron. Packag. 2005;127(1):38-42. doi:10.1115/1.1849231.

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PCR Microchip Array Based on Polymer Bonding Technique

References

Figures

A SEM photograph of the finished silicon chip array

(a) Microscope photos of split glass cover bonded by photoresist. (b) Microscope photos of split silicon chip bonded by photoresist.

(a) Microscope photo of a void-free bonded chip with polyimide as the intermediate layer. (b) Microscope photo of the split silicon chip with part of the polyimide left on the chip surface.

Microscope photo of a void-free bonded chip with epoxy as the intermediate layer

Detected Raman spectrum of fluorescence PCR performed on a chip with Taqman probes

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