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Article

Various Adhesives for Flip Chips

[+] Author and Article Information
Z. W. Zhong

School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore

J. Electron. Packag 127(1), 29-32 (Mar 21, 2005) (4 pages) doi:10.1115/1.1846064 History: Received January 07, 2004; Revised July 27, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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References

Lau, J. H., 1995, Flip Chip Technologies, MacGraw–Hill, New York.
Kloeser, J., Kutzner, K., and Gross, K. 1997, “A New Production Line for Low Cost Flip Chip Assembly,” Proceedings of the Technical Program, Surface Mount International, San Jose, CA, pp. 257–266.
Zhong,  Z., 2001, “Development of a Reliable Packaging Process for Flip Chip on Ceramics,” Microelectron. Int., 18(1), pp. 19–22.
Zhong,  Z., 2001, “Flip Chip Assemblies Using Gold Bumps and Adhesive,” Microelectron. Int., 18(3), pp. 15–19.
Zhong,  Z., 2001, “Reliability of Flip Chips on FR-4 Assembled with Reduced Process Steps,” Circuit World, 27(3), pp. 26–30.
Zhong,  Z., 1999, “Assembly and Reliability of Flip Chip on Boards Using ACAs or Eutectic Solder with Underfill,” Microelectron. Int., 16(3), pp. 6–14.
Bessho, Y. et al., 1990, “Chip-On-Glass Mounting Technology of LSIs for LCD Module,” IMC’90, pp. 183–189.
Potter, B., 1998, “Flip Chip Bonding Primer,” Circuits Assembly, September, pp. 72–75.
Ross, P. J., 1988, Taguchi Techniques for Quality Engineering, McGraw–Hill, New York.
Ott, E. R., 1990, Process Quality Control, McGraw–Hill, New York.
Montgomery, D. C., 1991, Design and Analysis of Experiments, Wiley, New York.
Cobb, G. W., 1998, Introduction to Design and Analysis of Experiments, Springer, New York.
Zhong,  Z., 2001, “Stud Bump Bond Packaging with Reduced Process Steps,” Soldering Surf. Mount Technol., 13(2), pp. 35–38.

Figures

Grahic Jump Location
The rework procedure developed for ACF processes
Grahic Jump Location
The rework procedure developed for ACP processes
Grahic Jump Location
A proposed SBB packaging process with reduced process steps

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