Various Adhesives for Flip Chips

[+] Author and Article Information
Z. W. Zhong

School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore

J. Electron. Packag 127(1), 29-32 (Mar 21, 2005) (4 pages) doi:10.1115/1.1846064 History: Received January 07, 2004; Revised July 27, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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Grahic Jump Location
The rework procedure developed for ACF processes
Grahic Jump Location
The rework procedure developed for ACP processes
Grahic Jump Location
A proposed SBB packaging process with reduced process steps




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