Resin Self-Alignment Processes for Self-Assembly Systems

[+] Author and Article Information
Jong-Min Kim, Kiyokazu Yasuda, Kozo Fujimoto

Department of Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamada-Oka, Suita, Osaka 565-0871, Japan

J. Electron. Packag 127(1), 18-24 (Mar 21, 2005) (7 pages) doi:10.1115/1.1846061 History: Received January 06, 2004; Revised July 08, 2004; Online March 21, 2005
Copyright © 2005 by ASME
Your Session has timed out. Please sign back in to continue.


Romig, Jr,  A. D., Dugger,  M. T., and McWhorter,  P. J., 2003, “Materials Issues in Microelectromechanical Devices: Science, Engineering, Manufacturability and Reliability,” Acta Mater., 51, pp. 5837–5866.
Oh,  K. W., Ahn,  C. H., and Roenker,  K. P., 1999, “Flip-Chip Packaging Using Micro-machined Conductive Polymer Bumps and Alignment Pedestals for MOEMS,” IEEE J. Sel. Top. Quantum Electron., 5(1), pp. 119–126.
Prather,  D. W., Venkataraman,  S., Lecompte,  M., Kiamilev,  F., Mait,  J. N., and Simonis,  G. J., 2001, “Optoelectronic Multichip Module Integration for Chip Level Optical Interconnects,” IEEE Photonics Technol. Lett., 13(10), pp. 1112–1114.
Holm,  J., Åhlfeldt,  H., Svensson,  M., and Vieider,  C., 2000, “Through-Etched Silicon Carriers for Passive Alignment of Optical Fibers to Surface-Active Optoelectronic Components,” Sens. Actuators, A, 82(1-3), pp. 245–248.
Linderman,  R. J., and Bright,  V. M., 2001, “Nanometer Precision Positioning Robots Utilizing Optimized Scratch Drive Actuators,” Sens. Actuators, A, 91(3), pp. 292–300.
Srinivasan,  U., Liepmann,  D., and Howe,  R. T., 2001, “Microstructure to Substrate Self-Assembly Using Capillary Forces,” J. Microelectromech. Syst., 10(1), pp. 17–24.
Martin,  B. R., Furnange,  D. C., Jackson,  T. N., Mallouk,  T. E., and Mayer,  T. S., 2001, “Self-Alignment of Patterned Wafers Using Capillary Forces at a Water-Air Interface,” Adv. Funct. Mater., 11(5), pp. 381–386.
Sato,  K., Ito,  K., Hata,  S., and Shimokohbe,  A., 2003, “Self-Alignment of Microparts Using Liquid Surface Tension-Behavior of Micropart and Alignment Characteristics,” Precis. Eng., 27(1), pp. 42–50.
Wale,  M. J., and Edge,  C., 1990, “Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(4), pp. 780–786.
Haugsjaa,  P. O., 1997, “Passive Alignment for Optoelectronic Components,” Adv. Electron. Packag. ASME, EEP-Vol., 19-1, pp. 753–758.
Miller,  L. F., 1969, “Controlled Collapse Reflow Chip Joining,” IBM J. Res. Dev., 13, pp. 239–250.
Park,  C. B., Hong,  S. M., Jung,  J. P., Kang,  C. S., and Shin,  Y. E., 2001, “A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5mass%Ag and Sn-37mass%Pb Solder,” Mater. Trans., JIM, 42(5), pp. 820–824.
Harris,  P. G., 1995, “Conductive Adhesives: A Critical Review of Progress to Date,” Soldering Surf. Mount Technol., 20, pp. 19–21.
Moon, K.-S., Wu, J., and Wong, C. P., 2001, “Study on Self-Alignment Capability of Electrically Conductive Adhesives (ECAs) for Flip-Chip Application,” International Symposium on Advanced Packaging Materials, pp. 341–346.
Heinrich,  S. M., Schaefer,  M., Schroeder,  S. A., and Lee,  P. S., 1996, “Prediction of Solder Joint Geometries in Array-Type Interconnects,” ASME J. Electron Packag., 118(3), pp. 114–121.
Chiang,  K.-N., and Chen,  W.-L., 1998, “Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array,” ASME J. Electron. Packag., 120(2), pp. 175–178.
Brakke, K. A., 1999, Surface Evolver Manual, Version 2.14. Mathematics Department Susquehanna Univ., Selinsgrove, PA.
Veen,  N. V., 1999, “Analytical Derivation of the Self-Alignment Motion of Flip Chip Soldered Components,” ASME J. Electron. Packag., 121(2), pp. 116–121.
Manko, H. H., 1992, Solders and Soldering, 3rd ed., McGraw-Hill, New York, Chap. 3.
Su,  B., Gershovich,  M., and Lee,  Y. C., 1997, “Gas Flow Effects on Precision Solder Self-Alignment,” IEEE Trans. Compon. Packag. Manuf. Technol., Part C, 20(4), pp. 305–311.
Kim,  J. M., Shin,  Y. E., and Fujimoto,  K., 2003, “Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability,” Mater. Sci. Forum, 439, pp. 12–17.
Landry,  M., Patra,  S. K., and Lee,  Y. C., 1991, “Experiment and Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering,” Manufac. Processes and Materials Challenges in Microelec. Packag. ASME, AMD-Vol., 131/EEP-Vol., 1, pp. 49–56.
Rao, S. S., 1995, Mechanical Vibrations, 3rd ed., Addison-Wesley, New York, Chap. 2.


Grahic Jump Location
Measured alignment accuracies at different levels of misalignment
Grahic Jump Location
Schematics of a self-alignment technique using the surface tension of (a) the water and (b) the molten solder
Grahic Jump Location
Principles of the resin self-alignment process of (a) the put-down model and (b) the pull-up model
Grahic Jump Location
Mathematical models of an axisymmetric liquid joint for (a) the put-down model and (b) the pull-up model
Grahic Jump Location
The assembly test vehicle
Grahic Jump Location
Diagram of the experimental system (pull-up model)
Grahic Jump Location
Relationship between the liquid volume and the stand-off height (SOH) normalized with respect to the pad radius
Grahic Jump Location
3-D liquid joint geometry with one of both dimensionless force and liquid volume: (a) SOH/r=0.31,θs=111.8 with convex geometry (put-down model); (b) SOH/r=0.33,θs=80.3 with concave geometry (pull-up model)
Grahic Jump Location
Restoring force acting on the component with different misalignment level for both alignment models
Grahic Jump Location
Self-alignment behaviors of (a) the put-down model and (b) the pull-up model
Grahic Jump Location
Self-alignment motions of (a) the put-down model and (b) the pull-up model with 100 μm for misalignment level




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In