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Article

Adhesive Joining Process and Joint Property With Low Melting Point Filler

[+] Author and Article Information
Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto

Department of Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamada-Oka, Suita, Osaka 565-0871, Japan

Telephone: +81-6-6879-7551; Fax: +81-6-6879-7570

J. Electron. Packag 127(1), 12-17 (Mar 21, 2005) (6 pages) doi:10.1115/1.1846060 History: Received January 06, 2004; Revised July 08, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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References

Figures

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Self-interconnection process using LMP (low melting point) alloy adhesive application. (a) Filler dispersion in resin, (b) filler coalescence and adhesional wetting on pads, (c) filler growth up to joint height and bridge formation between pads, (d) lateral flow by capillary force, and (e) completion of the interconnect
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DSC (differential scanning calorimetry) curves of ECA (electrically conductive adhesives) with LMP (low melting point) alloy (heating rate: 5 K/min)
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Flowchart of LMP (low melting point) joining process
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Configuration of substrate setup. (a) Misalignment joints (horizontal misalignment normal to Cu line direction: δx). (b) Aligned joints
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Cross-sectional photographs of LMP (low melting point) alloy adhesive joint. (a) Conduction path (type I) by resin A shown as a white line. (b) Conduction path (type II) by resin B. White arrows signify the conduction paths
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Cross-sectional photographs of LMP (low melting point) alloy adhesive joint. (a) Joint height: 100 μm. (b) Joint height: 300 μm
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Cross-sectional photographs of LMP (low melting point) alloy adhesive joint using resin B. (a) Joint height: 100 μm. (b) Joint height: 300 μm
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Micro-focused x-ray photographs showing morphology of self-organization. (Pattern pitch is 300 μm.) (a) Misaligned substrate. (b) Aligned substrate
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Cross-sectional photographs showing morphology of self-organization. (Pattern pitch is 100 μm.) (a) Without height control. (b) With height control

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