0
Article

Adhesive Joining Process and Joint Property With Low Melting Point Filler

[+] Author and Article Information
Kiyokazu Yasuda, Jong-Min Kim, Kozo Fujimoto

Department of Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamada-Oka, Suita, Osaka 565-0871, Japan

Telephone: +81-6-6879-7551; Fax: +81-6-6879-7570

J. Electron. Packag 127(1), 12-17 (Mar 21, 2005) (6 pages) doi:10.1115/1.1846060 History: Received January 06, 2004; Revised July 08, 2004; Online March 21, 2005
Copyright © 2005 by ASME
Your Session has timed out. Please sign back in to continue.

References

Ohta, Y., Yasuda, K., Fujimoto, K., Nishikawa, K., Yagi, Y., and Ohtani, H., 2002, Proc. 8th Symp. Microjoin. Assembly Techno. Electro. (Mate2002) Yokohama, 2002, pp. 169–174 (in Japanese).
Jin,  M., and Paik,  K. W., 1999, “The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF),” IEEE Trans. Adv. Packag., 22, p. 166.
Liu,  J., and Lai,  Z., 2002, “Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate,” ASME J. Electron. Packag., 124, pp. 240–245.
Ye,  L., Lai,  Z., Liu,  J., and Tholen,  A., 1999, “Effect of Ag Particle Size on Electrical Conductivity of Isotropically Conductive Adhesives,” IEEE Trans. Electron, Packag., Manuf., 22, pp. 299–302.
Yao,  Q., and Qu,  J., 2002, “Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness,” ASME J. Electron. Packag., 124, pp. 127–134.
Kotthaus,  S., Haug,  R., Schafer,  H., and Hennemann,  O. D., 1998, “Current-Induced Degradation of Isotropically Conductive Adhesives,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21, pp. 259–265.
Lu,  D., Tong,  Q. K., and Wong,  C. P., 1999, “Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s),” IEEE Trans. Electron., Packag., Manuf., 22, pp. 223–227.
Lu,  D., Tong,  Q. K., and Wong,  C. P., 1999, “Mechanisms Underlying the Unstable Contact Resistance of Conductive Adhesives,” IEEE Trans. Electron., Packag., Manuf., 22, pp. 228–232.
Dudek,  R., Berek,  H., Fritsch,  T., and Michel,  B., 2000, “Reliability Investigations on Conductive Adhesive Joints with Emphasis on the Mechanics of the Conduction Mechanism,” IEEE Trans. Compon., Packag., 23, pp. 462–469.
Lu,  D., and Wong,  C. P., 2000, “Development of Conductive Adhesives for Solder Replacement,” IEEE Trans. Compon., Packag., Technol., 23, pp. 620–626.
Lu,  D., and Wong,  C. P., 1999, “Novel Conductive Adhesives for Surface Mount Applications,” J. Appl. Polym. Sci., 74, pp. 399–406.
Li,  H., Johnson,  A., and Wong,  C. P., 2003, “Development of New No-Flow Underfill Materials for Both Eutectic Sn-Pb Solder and a High Temperature Melting Lead-Free Solder,” IEEE Trans. Compon., Packag., Technol., 26, pp. 466–472.
Yim,  M. J., Hwang,  J. S., Kwon,  W., Jang.,  K. W., and Paik,  K. W., 2003, “Highly Reliable Non-Conductive Adhesives for Flip Chip CSP Applications,” IEEE Trans. Electron., Packag., Manuf., 26, pp. 150–155.
Zhang, J., and Baldwin, D. F., 2003, “High-Speed SMT Compatible Dispenseless Underfill Process for CSP BGA Flip Chip Assembly,” Proc. of the 53th ECTC, pp. 870–874.
Zhao,  R., Johnson,  R. W., Jones,  G., Yaeger,  E., Konarski,  M., Krug,  P., and Crane,  L. L., 2003, “Processing of Fluxing Underfills for Flip Chip-on-Laminate Assembly,” IEEE Trans. Electron., Packag., Manuf., 26, pp. 75–83.
Yasuda, K., Kim, J. M., Rito, M., and Fujimoto, K., 2003, “Joining Mechanism and Joint Property by Polymer Adhesive with Low Melting Alloy Filler,” Int. Conf. on Electron. Packag., pp. 149–154.
Yasuda, K., Kim, J. M., Yasuda, M., and Fujimoto, K., 2003, “New Process of Self-Organized Interconnection in Packaging by Conductive Adhesive with Low Melting Point Filler,” Int. Conf. on Solid State Devices and Materials, pp. 390–391.
Yasuda, K., Kim, J. M., and Fujimoto, K., 2003, “Adhesive Joining Process and Joint Property with Low Melting Point Filler,” 3rd Int. IEEE Conf. on Polymer and Adhesives in Microelec. and Photon., pp. 5–10.
Mahajan,  R. L., Malhtra,  C. P., and Sharma,  R. K., 2002, “An Analytical Cure Model for Underfill Epoxies,” ASME J. Electron. Packag., 124, pp. 391–396.
Chen,  W., Chiang,  K., and Lin,  S., 2002, “Prediction of Liquid Formaition for Solder and Non-Solder Mask Defined Array Packages,” ASME J. Electron. Packag., 124, pp. 37–44.
Panton,  R. L., Lee,  J. W., Goenka,  L., and Achari,  A., 2003, “Simulation of Void Growth in Molten Solder Bumps,” ASME J. Electron. Packag., 125, pp. 329–334.

Figures

Grahic Jump Location
Self-interconnection process using LMP (low melting point) alloy adhesive application. (a) Filler dispersion in resin, (b) filler coalescence and adhesional wetting on pads, (c) filler growth up to joint height and bridge formation between pads, (d) lateral flow by capillary force, and (e) completion of the interconnect
Grahic Jump Location
DSC (differential scanning calorimetry) curves of ECA (electrically conductive adhesives) with LMP (low melting point) alloy (heating rate: 5 K/min)
Grahic Jump Location
Flowchart of LMP (low melting point) joining process
Grahic Jump Location
Configuration of substrate setup. (a) Misalignment joints (horizontal misalignment normal to Cu line direction: δx). (b) Aligned joints
Grahic Jump Location
Cross-sectional photographs of LMP (low melting point) alloy adhesive joint. (a) Conduction path (type I) by resin A shown as a white line. (b) Conduction path (type II) by resin B. White arrows signify the conduction paths
Grahic Jump Location
Cross-sectional photographs of LMP (low melting point) alloy adhesive joint. (a) Joint height: 100 μm. (b) Joint height: 300 μm
Grahic Jump Location
Cross-sectional photographs of LMP (low melting point) alloy adhesive joint using resin B. (a) Joint height: 100 μm. (b) Joint height: 300 μm
Grahic Jump Location
Micro-focused x-ray photographs showing morphology of self-organization. (Pattern pitch is 300 μm.) (a) Misaligned substrate. (b) Aligned substrate
Grahic Jump Location
Cross-sectional photographs showing morphology of self-organization. (Pattern pitch is 100 μm.) (a) Without height control. (b) With height control

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In