0
Article

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

[+] Author and Article Information
A. Polyakov, M. Bartek, J. N. Burghartz

Delft University of Technology, DIMES/HiTeC, Feldmannweg 17, 2628CT, Delft, The Netherlands

Telephone: +31 15 27 89421, Fax: +31 15 26 22163

J. Electron. Packag 127(1), 7-11 (Mar 21, 2005) (5 pages) doi:10.1115/1.1846059 History: Received January 06, 2004; Revised June 08, 2004; Online March 21, 2005
Copyright © 2005 by ASME
Your Session has timed out. Please sign back in to continue.

References

Burghartz,  J. N., and Rejaei,  B., 2003, “On the design of RF spiral inductors on silicon,” IEEE Trans. Electron Devices, 50(3), pp. 718–729.
Dekker,  R., Baltus,  P. G. M., and Maas,  H. G. R., 2003, “Substrate transfer for RF technologies,” IEEE Trans. Electron Devices, 50(3), pp. 747–757.
vd Green, S. et al., 1997, “CMOS compatible wafer scale adhesive bonding for circuit transfer,” Proc. Transducers ’97, Chicago, Vol. 1, pp. 629–632.
Garrou,  P. E. , 1999, “Stress-buffer and passivation processes for Si and GaAs IC’s and passive components using photosensitive BCB: process technology and reliability data,” IEEE Trans. Adv. Packag., 22(3), pp. 487–498.
Law, S. P. C., and Chan, P. C. H., 2002, “Process issues on peripheral to area-array bond pad redistribution,” Proc. Adv. Pack. Materials, pp. 25–29.
http://www.cyclotene.com/
Nicklaus,  F. , 2001, “Low temperature full wafer adhesive bonding of structured wafers,” Sens. Actuators, A, 92, pp. 235–241.
Oberhammer, J., and Stemme, G., 2003, “Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages,” Proc. Transducers’03, Vol. 2, pp. 1832–1835.
Chinoy,  P. B., 1997, “Reactive ion etching of benzocyclobutene polymer films,” IEEE Trans. Compon., Packag., Manuf. Technol., Part C, 20(3), pp. 199–206.
Pardoen, T., Iker, F., Zhang, X. X., and Raskin, J. P., 2002, “Steady-state measurement of wafer bonding cracking resistance,” Proc. Eurosensors XVI, Prague, Czech Republic, pp. 294–297.
Maszara,  W. P., Goetz,  G., Caviglia,  G., and McKitterick,  J. B., 1998, “Bonding of silicon wafers for silicon-on-insulator,” J. Appl. Phys., 64(10), p. 4943.
Suwito,  W., Dunna,  M. L., Cunningham,  S. J., and Read,  D. T., 1999, “Elastic moduli, strength, and fracture initiation at sharp notches in etched single crystal silicon microstructures,” J. Appl. Phys., 85(7), pp. 3519–3533.
Corning Co. product datasheet Pyrex 7740.
Liu,  Z., and De Voe,  D. L., 2000, “Micromechanism fabrication using silicon fusion bonding,” Rob. Comput.-Integr. Manufact., 17, pp. 131–137.
http://www.loctite.com/
Im,  J., Shaffer,  E., Stokich,  T., Strandjord,  A., Hetzner,  , Curphy,  J., Karas,  C., Meyers,  G., Hawn,  D., Chakrabarti,  A., and Froelicher,  S., 2000, “On the mechanical reliability of photo-BCB-based Thin Film Dielectric Polymer for Electronic Packaging Applications,” ASME J. Electron. Packag., 122, pp. 28–33.
Pan,  C. T., Yang,  H., Shen,  S. C., Chou,  M. C., and Chou,  H. P., 2002, “A low-temperature wafer bonding technique using patternable materials,” J. Micromech. Microeng., 12, pp. 611–615.
Go, J. S., and Cho, Y. H., 1998, “Experimental evaluation of anodic bonding process using taguchi method for maximum interfacial fracture toughness,” Proc. MEMS’98, pp. 318–321.
Tsau,  C. T., Spearing,  S. M., and Schmidt,  M. A., 2002, “Fabrication of wafer-level thermocompression bonds,” J. MEMS, 11(6), pp. 641–647.
Polyakov, A., Mendes, P. M., Sinaga, S. M., Bartek, M., Rejaei, B., Correia, J., and Burghartz, J. N., 2003, “Processability and Electrical Characteristics of Glass Substrates for RF Wafer-Level Chip-Scale Packages,” Proc. 53rd ECTC, New Orleans, LA.
Pham, N. P., Scholtes, T. L. M., Klerks, R., Boellaard, E., Sarro, P. M., and Burghartz, J. N., 2002, “Direct spray coating of photoresist-a new method for patterning 3-D structures,” Proc. Eurosensors XVI, Prague, Czech Republic, pp. 182–185.
Turmezei, P., Polyakov, A., Mollinger, J. R., Bartek, M., Bossche, A., and Burghartz, J. N., 2003, “Low-Cost Microfilter for Red Blood Cell Membrane Stiffness Measurement Using Photosensitive BCB,” Proc. Transducers’03, Vol. 1, pp. 107–110.

Figures

Grahic Jump Location
Wedge-opening method and schematic view of a test specimen bonded with photosensitive BCB
Grahic Jump Location
Tensile method: (a) top view of two types of specimens under test; (b) measurement setup
Grahic Jump Location
BCB profile before and after bonding: (a) BCB sidewalls after development prior to bonding; (b) SEM photograph of cross-section after bonding
Grahic Jump Location
Measured tensile strength (a) as a function of bonded area and example of force displacement. Diagram (b) in tensile loading of test specimen with 9% bonded area.
Grahic Jump Location
Schematic view of the process flow for WL CSP fabrication .
Grahic Jump Location
SEM photographs of fabricated WL CSP: (a) two-step TMAOH etched through-wafer interconnects and (b) contact opening in BCB layer
Grahic Jump Location
Microfilter fabricated using BCB-bonding: (a) fabrication flowchart; and (b) optical photograph of filter posts through the glass substrate

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In