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Article

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

[+] Author and Article Information
A. Polyakov, M. Bartek, J. N. Burghartz

Delft University of Technology, DIMES/HiTeC, Feldmannweg 17, 2628CT, Delft, The Netherlands

Telephone: +31 15 27 89421, Fax: +31 15 26 22163

J. Electron. Packag 127(1), 7-11 (Mar 21, 2005) (5 pages) doi:10.1115/1.1846059 History: Received January 06, 2004; Revised June 08, 2004; Online March 21, 2005
Copyright © 2005 by ASME
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References

Figures

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Wedge-opening method and schematic view of a test specimen bonded with photosensitive BCB
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Tensile method: (a) top view of two types of specimens under test; (b) measurement setup
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BCB profile before and after bonding: (a) BCB sidewalls after development prior to bonding; (b) SEM photograph of cross-section after bonding
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Measured tensile strength (a) as a function of bonded area and example of force displacement. Diagram (b) in tensile loading of test specimen with 9% bonded area.
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Schematic view of the process flow for WL CSP fabrication .
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SEM photographs of fabricated WL CSP: (a) two-step TMAOH etched through-wafer interconnects and (b) contact opening in BCB layer
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Microfilter fabricated using BCB-bonding: (a) fabrication flowchart; and (b) optical photograph of filter posts through the glass substrate

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