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TECHNOLOGY REVIEW

Highlights from the European Thermal Project PROFIT

[+] Author and Article Information
Clemens J. M. Lasance

Philips Research Laboratories, Prof. Holstlaan 4, 5656 AA Eindhoven, The Netherlands

J. Electron. Packag 126(4), 565-570 (Jan 24, 2005) (6 pages) doi:10.1115/1.1827258 History: Received April 20, 2004; Revised September 21, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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Differences between detailed and compact models for four different boundary conditions. Upper: P-MQFP-80, Lower: P-LFBGA-72.
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Sketch of the interface resistance tester
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Thermal resistance of a soft TIM as a function of pressure
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The differential structure function for an Intel Processor showing various package characteristics
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Board analysis extended with footprints and compact models
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Thermal feedback effects in an opamp dominate the transfer characteristics
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Scalable test die with 7×7 elements
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Failure rates for TFBGA 168 packages on an operational test board. PC: power cycling, TC: temperature cycling.
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Heat transfer coefficient distribution using a Copper PCB. Forced convection, v=10 m/s.
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Compact model of the BGA benchmark
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Sketch of the BGA benchmark. Quarter symmetry. Some parts (substrates and balls) have anisotropic thermal conductivity.

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