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TECHNICAL BRIEF

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

[+] Author and Article Information
Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu

Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Road, Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan

J. Electron. Packag 126(4), 560-564 (Jan 24, 2005) (5 pages) doi:10.1115/1.1827271 History: Received August 28, 2003; Revised June 08, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Popelar,  S., and Roesch,  M., 2000, “Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies,” Int. J. Microcircuits Electron. Packag., 23(4), pp. 462–468.
Zahn, B. A., 2000, “Comprehensive Solder Fatigue and Thermal Characterization of a Silicon Based Multi-Chip Module Package Utilizing Finite Element Analysis Methodologies,” Proc. 9th International ANSYS Conference Exhibit, 9th International ANSYS Conference and Exhibitions, Pittsburgh, PA, USA.
Wiese, S., Schubert, A., Walter, H., Dudek, R., Feustel, F., Meusel, E., and Michel, B., 2001, “Constitutive Behaviour of Lead-Free Solders vs. Lead-Containing Solders Experiments on Bulk Specimens and Flip-Chip Joints,” Proc. 51st Electr. Comp. Technol. Conference, 51st Electronic Components and Technology Conference, Lake Buena Vista, CA, USA, pp. 890–902.
Darveaux,  R., 2002, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction,” J. Electron. Packag., 124(3), pp. 147–154.
Lau,  J. H., Lee,  S. W. R., Pan,  S. H., and Chang,  C., 2002, “Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications,” J. Electron. Packag., 124, pp. 205–211.
Schubert, A., Dudek, R., Walter, H., Jung, E., Gollhardt, A., Michel, B., and Reichl, H., 2002, “Reliability Assessment of Flip-Chip Assemblies With Lead-Free Solder Joints,” Proc. 52nd Electr. Comp. Technol. Conference, 52nd Electronic Components and Technology Conference, San Diego, CA, USA.
Dutta,  I., Gopinath,  A., and Marshall,  C., 2002, “Underfill Constraint Effects During Thermo-Mechanical Cycling of Flip Chip Solder Joints,” J. Electron. Mater., 31(4), pp. 253–264.
Schubert, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B., and Reichl, H., 2003, “Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation,” Proc. 53rd Electr. Comp. Technol. Conference, 53rd Electronic Components and Technology Conference, New Orleans, LA, USA, pp. 603–610.
Chiang,  K.-N., and Yuan,  C.-A., 2001, “An Overview of Solder Bump Shape Prediction Algorithms With Validations,” IEEE Transactions on Advanced Packaging 24(2), pp. 158–162.
Skrzypek, J. J., 1993, Plasticity and Creep, CRC press, Boca Raton.

Figures

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Plot of temperature-dependent Young’s moduli for virtual underfills
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Hysteresis loops for package without underfill
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(a) High-E/high-Tg/low-α underfill and (b) high-E/low-Tg/high-α underfill
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(a) High-E/high-α underfill and (b) high-E/low-α underfill
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Creep strain energy densities on the last cycle for underfills with two-stage material properties
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Creep strain energy densities on the last cycle for underfills with constant material properties
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Creep shear strain ranges on the last cycle for underfills with two-stage material properties
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Creep shear strain ranges on the last cycle for underfills with constant material properties

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