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TECHNICAL BRIEF

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

[+] Author and Article Information
Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu

Stress-Reliability Lab, Advanced Semiconductor Engineering, Inc., 26 Chin 3rd Road, Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan

J. Electron. Packag 126(4), 560-564 (Jan 24, 2005) (5 pages) doi:10.1115/1.1827271 History: Received August 28, 2003; Revised June 08, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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Plot of temperature-dependent Young’s moduli for virtual underfills
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Hysteresis loops for package without underfill
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(a) High-E/high-Tg/low-α underfill and (b) high-E/low-Tg/high-α underfill
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(a) High-E/high-α underfill and (b) high-E/low-α underfill
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Creep strain energy densities on the last cycle for underfills with two-stage material properties
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Creep strain energy densities on the last cycle for underfills with constant material properties
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Creep shear strain ranges on the last cycle for underfills with two-stage material properties
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Creep shear strain ranges on the last cycle for underfills with constant material properties

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