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RESEARCH PAPER

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

[+] Author and Article Information
C. P. Tso

Faculty of Engineering & Technology, Multimedia University, Jalan Ayer Keroh Lama, 75450 Melaka, Malaysia

K. W. Tou, H. Bhowmik

School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798

J. Electron. Packag 126(4), 546-553 (Jan 24, 2005) (8 pages) doi:10.1115/1.1827270 History: Received October 08, 2003; Revised June 14, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

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Siegel,  R., and Perlmutter,  M., 1963, “Laminar Heat Transfer in a Channel With Unsteady Flow and Wall Heating Varying With Position and Time,” ASME J. Heat Transfer, 85C, pp. 358–365.
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Figures

Grahic Jump Location
Schematic diagram of model configuration and flow orientation
Grahic Jump Location
Typical transient chip wall temperature history
Grahic Jump Location
Nusselt number and Rayleigh number variations during pump-off transient operations
Grahic Jump Location
Selection of exponent n for correlation
Grahic Jump Location
(Nul/Ral1/4) versus Fo during transient operation
Grahic Jump Location
Numerical steady-state results
Grahic Jump Location
Comparison of numerical results with experimental results during transient operation

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