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RESEARCH PAPER

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

[+] Author and Article Information
C. P. Tso

Faculty of Engineering & Technology, Multimedia University, Jalan Ayer Keroh Lama, 75450 Melaka, Malaysia

K. W. Tou, H. Bhowmik

School of Mechanical and Production Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798

J. Electron. Packag 126(4), 546-553 (Jan 24, 2005) (8 pages) doi:10.1115/1.1827270 History: Received October 08, 2003; Revised June 14, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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Schematic diagram of model configuration and flow orientation
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Typical transient chip wall temperature history
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Nusselt number and Rayleigh number variations during pump-off transient operations
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Selection of exponent n for correlation
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(Nul/Ral1/4) versus Fo during transient operation
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Numerical steady-state results
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Comparison of numerical results with experimental results during transient operation

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