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RESEARCH PAPER

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

[+] Author and Article Information
S. B. Sathe, B. G. Sammakia

SUNY Binghamton, NY 13902

J. Electron. Packag 126(4), 528-534 (Jan 24, 2005) (7 pages) doi:10.1115/1.1827269 History: Received June 11, 2004; Revised August 10, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Kiley, R. F., and Soule, C. A., 1990, “Engineered Heat Sinks,” Powertechnics Mag., July.
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Biskeborn, R. G., Horvath, J. L., and Hultmark, E. B., 1984, “Integral Cap Heat Sink Assembly for the IBM 4381 Processor,” Proc. of Technical Conference, Fourth Annual International Electronic Packaging Society Conf., Baltimore, pp. 468–474.
Oktay, S., Dessauer, B., and Horvath, J. L., 1983, “New Internal and External Cooling Enhancements for the IBM 4381 Module,” ICCD 83, Proc. of IEEE International Conference on Computer Design: VLSI in Computers, Port Chester, NJ.
Sathe, S. B., Kelkar, K. M., Karki, K. C., Tai, C. C., Lamb, C. R., and Patankar, S. V., 1993, “Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink,” Proc. of ASME International Electronics Packaging Conference, Binghamton, NY, ASME, New York, EEP Vol. 4-2, pp. 893–898.
McPhee, J. M., O’Toole, T. S., and Yedvabny, M., 1990, “Cooling the VAX 9000,” Electro/90 (conference record), Boston, pp. 288–292.
Fitch, J. S., 1990, “A One-Dimensional Thermal Model for the VAX 9000 Multi-Chip Units,” Thermal Modeling and Design of Electronic Systems and Devices, R. A. Wirtz and G. L. Lehmann, eds., ASME Winter Annual Meeting, Dallas, ASME, New York, HTD Vol. 153, pp. 59–64.
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Sathe, S. B., Stutzman, R. J., and Kostcva, S., 1994, “Development of a High-Performance, Low Pressure Drop Water Cold Plate for Electronic Packaging Applications,” Heat Transfer in Electronic Systems, ASME, New York, HTD-Vol. 292, pp. 123–128.
FLOTHERM Instruction Manual, 1992, Flomerics Ltd., Surrey, U.K.

Figures

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Schematic diagram of the flow-through heat sink
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Schematic diagram of the impingement heat sink
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Schematic diagrams showing different fin shapes used in analysis cases (a) through (f) in Table 3, respectively
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The velocity vectors (m/s) and pressure contours (N/m2) for analysis cases (a) through (f), respectively. The pressure contours are equally spaced over the total range from 0 to the value in Table 3.
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(a) and (f) are the temperature contours (C) for analysis cases (a) and (f), respectively. 1822 W is applied at the base. The contours are equally spaced over the total temperature range shown in the figure.
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(a) to (f) are the temperature profiles (C) at z=0, 10, 30, and 50 mm for analysis cases (a) through (f), respectively. The temperatures are shown for the air in the middle of the channel as well as for the corresponding fin temperature. The temperatures correspond to the bottom of the 5 mm thick heat sink base. The x direction refers to the distance from the centerline in meters.
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Heat sink profile for design point 2 and validation of the numerical analysis

Tables

Errata

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