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RESEARCH PAPER

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

[+] Author and Article Information
Wonkee Ahn, Dereje Agonafer

Electronics, MEMS and Nano Systems Packaging Center, Mechanical and Aerospace Engineering Department, University of Texas at Arlington, Arlington, TX 76010

Shlomo Novotny

Sun Microsystems, 1 Network Drive, Mail Stop UBUR03-213, Burlington, MA 01803

J. Electron. Packag 126(4), 524-527 (Jan 24, 2005) (4 pages) doi:10.1115/1.1827268 History: Received June 08, 2004; Revised September 27, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Suhir, E., and Weld, J. D., 1996, “Application of Surrogate Layer for Lower Bending Stress in a Tri-Material Body,” Proc. of ASME International Mechanical Engineering Congress and Exposition, Dallas, ASME, New York, WA/EEP-1, pp. 435–439.
Ahn, W., and Agonafer, D., 2003, The Impact of Board Layout and Stack-Up on PWB Warpage During Fabrication and Reflow Soldering Process, UTA-SUN Project Report.
Wang, P., Huang, G., Ching, H., Hsu, H., Novotny, S., Ahn, W., and Agonafer, D., 2004, μPGA Socket and Solder Joint Reliability Study, Proc. of Pan Pacific Electronic Conference and SMTA, 3, Kauai, Hawaii, pp. 67–84.
Morgan,  H. S., 1995, “Thermal Stress in Layered Electrical Assemblies Bonded With Solder,” ASME J. Electron. Packag., 114, pp. 350–354.
Tierney,  J. W., and Eischen,  J. W., 1997, “Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading,” ASME J. Electron. Packag., 119, pp. 281–287.
Cifuentes,  A. O., and Shareef,  I. A., 1993, “Some Modeling Issues on the Finite Element Computation of Thermal Stress in Metal Lines,” ASME J. Electron. Packag., 115, pp. 392–403.
Kelly, G. et al., 1994, Accurate Prediction of PQFP Warpage, Proc. of Electronic Components and Technology Conference, Washington, DC, pp. 102–106.
Structural Dynamic Research Corp., 2002, PCB.xchange and PCB.modleler User’s Guide.
Cadence, 2002, Allegro/APD Design Guide User’s Manual.
Intermediate Design Integration, IDF Instructions.
Maya Heat Transfer Technologies, web site: www.mayahtt.com

Figures

Grahic Jump Location
Schematic mapping: Design-analysis integration
Grahic Jump Location
Meshing, load, result of PWBA model

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