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RESEARCH PAPER

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

[+] Author and Article Information
Roger Schmidt, Ethan Cruz

IBM Corporation, Poughkeepsie, NY 12601

J. Electron. Packag 126(4), 510-518 (Jan 24, 2005) (9 pages) doi:10.1115/1.1827266 History: Received May 14, 2004; Revised October 05, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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Equipment power density trends
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Layout of data center considered in the present study
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Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
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Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
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Rack inlet temperatures: 4 kW racks/100% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/100% flow (increase in inlet temperature to rack above underfloor air temperature)
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Rack inlet temperatures: 8 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 8 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
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Rack inlet temperatures: 12 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
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Rack inlet temperatures: 12 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)

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