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RESEARCH PAPER

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

[+] Author and Article Information
Roger Schmidt, Ethan Cruz

IBM Corporation, Poughkeepsie, NY 12601

J. Electron. Packag 126(4), 510-518 (Jan 24, 2005) (9 pages) doi:10.1115/1.1827266 History: Received May 14, 2004; Revised October 05, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

The Uptime Institute, “Heat Density Trends in Data Processing, Computer Systems and Telecommunication Equipment” (white paper), www.uptimeinstitute.org.
Schmidt, R., 2001, “Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures,” Advances in Electronic Packaging 2001 (Proc. of IPACK ’01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Kauai, July, ASME, New York, Vol. 2, ASME Paper No. IPACK2001-15870, pp. 1097–1106.
Schmidt, R., and Cruz, E., 2002, “Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures of Chilled Air Exiting Both the Hot and Cold Aisles,” Proceedings of Itherm Conference, San Diego, June, pp. 580–594.
Schmidt, R., and Cruz, E., 2002, “Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks,” IMECE Conference, New Orleans, Nov., ASME New York.
Schmidt, R., and Cruz, E., 2003, “Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks are Removed,” Interpack Conference, Maui, July (to be published).
Schmidt, R., and Cruz, E., 2003, “Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Rack Flowrates are Reduced,” Interpack Conference, Maui, July (to be published).
Patel, C., Bash, C., Belady, C., Stahl, L., and Sullivan, D., 2001, “Computational Fluid Dynamics Modeling of High Compute Density Data Centers to Assure System Inlet Air Specifications,” Advances in Electronic Packaging 2001 (Proc. of IPACK ‘01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Kauai, July, ASME, New York, Vol. 2, ASME Paper No. IPACK2001-15662, pp. 821–829.
Patel, C., Sharma, R., Bash, C., and Beitelmal, A., 2002, “Thermal Considerations in Cooling Large Scale Computer Density Data Centers,” Itherm Conference, San Diego, June, pp. 767–776.
Awbi,  H. B., and Gan,  G., 1994, “Predicting Air Flow and Thermal Comfort in Offices,” ASHRAE J., Feb., pp. 17–21.
Bullock,  C. E., and Phillip,  F., 1996, “The Sistine Chapel: HVAC Design for Special-Use Buildings,” ASHRAE J., 38(4), April, pp. 49–58.
Cinato, P., Bianco, C., Licciardi, L., Pizzuti, F., Antonetti, M., and Grossoni, M., 1998, “An Innovative Approach to the Environmental System Design for TLC Rooms in Telecopm Italia,” Intelec98.
Kiff, P., 1995, “A Fresh Approach to Cooling Network Equipment,” Brit. Telecommun. Eng., July.
Quivey, B., and Bailey, A. M., 1999, “Cooling of Large Computer Rooms—Design and Construction of ASCI10 TeraOps,” Interpack99, June, Maui.
Schmidt, R., 1997, “Thermal Management of Office Data Processing Centers,” Advances in Electronic Packaging 1997 (Proc. of The Pacific Rim/ASME International Electronic Packaging Technical Conference, INTERpack ‘97), Kohala Coast, HI, June, ASME, New York, Vol. 2, ASME Paper No. EEP-Vol 19-2, pp. 1995–2010.
Seymour, M., 1992, “Dynamic Design on Atria,” Build. Services, Jan., pp. 27–29.
Kang,  S., Schmidt,  R., Kelkar,  K., and Patankar,  S., 2001, “A Methodology for the Design of Perforated Tiles in Raised Floor Data Centers Using Computational Flow Analysis,” IEEE-CPMT J.,24(2), pp. 177–183.
Schmidt, R., Karki, K., Kelkar, K., Radmehr, A., and Patankar, S., 2001, “Measurements and Predictions of the Flow Distribution Through Perforated Tiles in Raised Floor Data Centers,” Advances in Electronic Packaging 2001 (Proc. of IPACK ‘01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Kauai, July, ASME, New York, Vol. 2, ASME Paper No. IPACK2001-15728, pp. 905–914.
Flotherm Instruction Manual, Flomerics Ltd., UK.

Figures

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Equipment power density trends
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Layout of data center considered in the present study
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Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/100% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 4 kW racks/100% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 8 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 8 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 12 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)
Grahic Jump Location
Rack inlet temperatures: 12 kW racks/80% flow (increase in inlet temperature to rack above underfloor air temperature)

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