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RESEARCH PAPER

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

[+] Author and Article Information
Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair

Fluent Inc., 10 Cavendish Court, Lebanon, NH 03766

J. Electron. Packag 126(4), 472-476 (Jan 24, 2005) (5 pages) doi:10.1115/1.1827263 History: Received April 28, 2004; Revised May 04, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Bar-Cohen, A., and Krueger, W. B., 1997, “Thermal Characterization of Chip Packages-Evolutionary Development of Compact Models,” Thirteenth IEEE SEMI-THERM Symposium, pp. 180–197.
Bar-Cohen,  A., Elperin,  T., and Eliasi,  E., 1989, “θja Characterization of Chip-Packages–Justification, Limitations and Future,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 12, pp. 724–731.
Lasance, C. J. M., 1997, “Thermal Characterization of Electronic Parts With Compact Models: Interpretation, Application, and The Need for a Paradigm Shift,” Proc. of 13th IEEE SEMITHERM Symposium, IEEE, New York, pp. 40–48.
Lasance,  C. J. M., Vinke,  H., and Rosten,  H., 1995, “Thermal Characterization of Electronic Devices With Boundary Condition Independent Compact Models,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 18, pp. 723–731.
Vinke, H., and Lasance, C. J. M., 1997, “Recent Achievements in the Thermal Characterization of Electronic Devices by Means of Boundary Condition Independent Compact Models,” Proc. of 13th IEEE SEMI-THERM Symposium, IEEE, New York, pp. 32–39.
Rosten, H., et al., 1995, “Development, Validation and Application of a Thermal Model of a Plastic Quad Flat Pack,” Proc. of 45th Electronic Components and Technology Conference, Las Vegas, IEEE, New York, pp 1140–1151.
Rosten, H., and Lasance, C. J. M., 1994, “The Development of Libraries of Thermal Models of Electronics Components for an Integrated Design Environment,” Proc. of Inter. Elect. Pack. Conf. (IEPS), Atlanta, IEEC, Binghampton, NY, pp. 138–147.
Lasance, C. J. M., Den Hertog, D., and Stehouwer, P., 1999, “Creation and Evaluation of Compact Models for Thermal Characterization Using Dedicated Optimization Software,” Proc. of SEMITHERM ‘99, San Diego, C/S Communications, Inc., Tempe, AZ, pp. 189–200.
Stehouwer, P., and Den Hertog, D., 1999, “Simulation-Based Design Optimization: Methodology and Applications,” First ASMO UK/ISSMO Conference on Engineering Design Optimization.
Sabry, M. N., 2001, “Compact Thermal Models for Electronic Systems,” Proc. 7th THERMINIC Workshop, TIMA Laboratory, Grenoble, France, p. 197.
Bosch, E. G. T., 2001, “Thermal Compact Models: An Alternative Approach,” Proc. 7th THERMINIC Workshop, p. 191.
Boyalakuntla, D., and Murthy, J. Y., 2001, “COBRA Based Compact Models for Simulation of Electronic Chip Packages,” Proc. of IPACK’01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July, ASME, New York, Paper No: 15534.
Mathur,  S. R., and Murthy,  J. Y., 1997, “A Pressure-Based Method for Unstructured Meshes,” Numer. Heat Transfer, Part B, 31(2), pp. 195–2216.
Hutchinson,  B. R., and Raithby,  G. D., 1986, “A Multigrid Method Based on the Additive Correction Strategy,” Numer. Heat Transfer, 9, pp. 511–537.
Nagulapally, M., and Zhao, S. Z., “Automatic Generation and Validation of Compact Network Models for a Fine Pitch BGA Package,” ASME, New York, Proc. of INTERPACK’03, Hawaii, July.
Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere, New York.
Icepak Version 4 Users Guide, 2001, Fluent Inc., Lebanon, NH.

Figures

Grahic Jump Location
Network model for a typical 2-D chip package
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Schematic of the FBGA package
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ACE network topology of the FBGA
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Transient response of a 14-node ACE network compared to the detailed FBGA

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