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RESEARCH PAPER

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

[+] Author and Article Information
Brian H. Dennis, Zhen-xue Han, George S. Dulikravich

J. Electron. Packag 126(4), 457-464 (Jan 24, 2005) (8 pages) doi:10.1115/1.1827261 History: Received April 26, 2004; Revised April 28, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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Cross section showing material regions for BGA model
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Hexahedral mesh for PWB and EMC
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Closeup view of mesh for solder balls, solder mask, and PWB
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Computed temperature on PWB and EMC
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Computed temperature on solder balls, solder mask, and PWB
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Computed inverse and forward temperature on BT substrate bottom
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Computed inverse and forward temperature on die bottom
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Computed forward temperature on package top with measurement errors
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Variation of average relative error in temperature on BT substrate bottom
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Computed inverse and forward temperature on BT substrate bottom with measurement errors and Λ=1.0×10−4
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Computed inverse and forward temperature on die bottom with measurement errors and Λ=1.0×10−4

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