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RESEARCH PAPER

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

[+] Author and Article Information
K. Ramakrishna

Interconnect Reliability, CMOS Platform Device Development, Technology Solutions Organization, Freescale Semiconductor, Inc., 3501 Ed Bluestein Boulevard, TX11/K10, Austin, TX 78721

T.-Y. Tom Lee

Final Manufacturing Technology Center, Technology and Manufacturing Organization, Freescale Semiconductor, Inc., 2100 E. Elliot Road, AZ34/EL725, Tempe, AZ 78524

J. Electron. Packag 126(4), 449-456 (Jan 24, 2005) (8 pages) doi:10.1115/1.1827260 History: Received April 26, 2004; Revised June 23, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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Schematic Cross section of a package level conjugate heat transfer model.
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Cross section of a typical HDI substrate with layout and through and microvias. The HDI core is made of BT resin cloth/composite. Dielectric between different layers is made of BT resin.
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Cross section of 1s2p JEDEC-type printed wiring board along with C5 layer in the model. M1 has 25% copper. Metal layers M2 and M3 have 100% copper.
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Schematic diagram of various thermal enhancements considered in this study.
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Details of heat spreader attachment to the back of the die. The dimensions shown in the figure are fixed in this study.
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Details of overmolded die with a copper heat spreader attached on the top of the overmold. Thickness of the overmold on the die is 1.15 mm above the FC-PBGA HDI substrate.
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CFD model of a six-layer 29 mm FC-PBGA substrate (base case) of thickness 1.096 mm with 48.4 mm2 die (7.812×6.192 mm): Overall CFD model shows the wind tunnel, and the package and PWB assembly in it. Base case parameters are kzz,bump/UF=1.66 W/(m K),kxx,bump/UF=kyy,bump/UF=0.6 W/(m K),kzz,od=0.5 W/(m K), and kzz,ud=1.0 W/(m K). No thermal balls and no PTHs in the PWB. Ta=30°C. P=1 W.
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Effect of out-of-plane bump/underfill layer thermal conductivity, kz,bump/UF, on Θja for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection conditions.
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Effect of out-of-plane bump/underfill layer thermal conductivity, kz,bump/UF, on Ψjb for a 25 mm FC-PBGA package with HDI substrate in forced convection.
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Effect of out-of-plane bump/underfill layer thermal conductivity, kz,bump/UF, on ΨjT for a 25 mm FC-PBGA package with HDI substrate in forced convection.
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Effect of bump/underfill thermal layer in-plane conductivity, kx,bump/UF, on Θja, for a 25 mm FC-PBGA package with HDI substrate in natural convection.
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Effect of thermal enhancements due to the thermal balls and the connected PTHs on Θja for a 25 mm FC-PBGA package with HDI substrate under natural and forced convection conditions.
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Effect of thermal enhancements due to thermal balls and the connected PTHs on Ψjb, for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection cooling.
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Effect of thermal enhancements due to heat spreader without and with overmolded die in Θja, for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection conditions.
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Thermal enhancements due to heat spreader without and with overmolded die: Effect on Ψjb for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection cooling.
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Effect of substrate size on the thermal enhancements due to heat spreader without and with overmolded die: Effect on Θja with a 48.4 mm2 die under natural and forced convection conditions.
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Effect of substrate size on the thermal enhancements due to heat spreader without and with overmolded die: Effect on Ψjb with a 48.4 mm2 die under natural and forced convection conditions.

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