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RESEARCH PAPER

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

[+] Author and Article Information
K. Ramakrishna

Interconnect Reliability, CMOS Platform Device Development, Technology Solutions Organization, Freescale Semiconductor, Inc., 3501 Ed Bluestein Boulevard, TX11/K10, Austin, TX 78721

T.-Y. Tom Lee

Final Manufacturing Technology Center, Technology and Manufacturing Organization, Freescale Semiconductor, Inc., 2100 E. Elliot Road, AZ34/EL725, Tempe, AZ 78524

J. Electron. Packag 126(4), 449-456 (Jan 24, 2005) (8 pages) doi:10.1115/1.1827260 History: Received April 26, 2004; Revised June 23, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

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Figures

Grahic Jump Location
Effect of substrate size on the thermal enhancements due to heat spreader without and with overmolded die: Effect on Θja with a 48.4 mm2 die under natural and forced convection conditions.
Grahic Jump Location
Effect of substrate size on the thermal enhancements due to heat spreader without and with overmolded die: Effect on Ψjb with a 48.4 mm2 die under natural and forced convection conditions.
Grahic Jump Location
Schematic diagram of various thermal enhancements considered in this study.
Grahic Jump Location
Details of heat spreader attachment to the back of the die. The dimensions shown in the figure are fixed in this study.
Grahic Jump Location
Details of overmolded die with a copper heat spreader attached on the top of the overmold. Thickness of the overmold on the die is 1.15 mm above the FC-PBGA HDI substrate.
Grahic Jump Location
CFD model of a six-layer 29 mm FC-PBGA substrate (base case) of thickness 1.096 mm with 48.4 mm2 die (7.812×6.192 mm): Overall CFD model shows the wind tunnel, and the package and PWB assembly in it. Base case parameters are kzz,bump/UF=1.66 W/(m K),kxx,bump/UF=kyy,bump/UF=0.6 W/(m K),kzz,od=0.5 W/(m K), and kzz,ud=1.0 W/(m K). No thermal balls and no PTHs in the PWB. Ta=30°C. P=1 W.
Grahic Jump Location
Effect of out-of-plane bump/underfill layer thermal conductivity, kz,bump/UF, on Θja for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection conditions.
Grahic Jump Location
Effect of out-of-plane bump/underfill layer thermal conductivity, kz,bump/UF, on Ψjb for a 25 mm FC-PBGA package with HDI substrate in forced convection.
Grahic Jump Location
Effect of out-of-plane bump/underfill layer thermal conductivity, kz,bump/UF, on ΨjT for a 25 mm FC-PBGA package with HDI substrate in forced convection.
Grahic Jump Location
Schematic Cross section of a package level conjugate heat transfer model.
Grahic Jump Location
Cross section of a typical HDI substrate with layout and through and microvias. The HDI core is made of BT resin cloth/composite. Dielectric between different layers is made of BT resin.
Grahic Jump Location
Cross section of 1s2p JEDEC-type printed wiring board along with C5 layer in the model. M1 has 25% copper. Metal layers M2 and M3 have 100% copper.
Grahic Jump Location
Effect of bump/underfill thermal layer in-plane conductivity, kx,bump/UF, on Θja, for a 25 mm FC-PBGA package with HDI substrate in natural convection.
Grahic Jump Location
Effect of thermal enhancements due to the thermal balls and the connected PTHs on Θja for a 25 mm FC-PBGA package with HDI substrate under natural and forced convection conditions.
Grahic Jump Location
Effect of thermal enhancements due to thermal balls and the connected PTHs on Ψjb, for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection cooling.
Grahic Jump Location
Effect of thermal enhancements due to heat spreader without and with overmolded die in Θja, for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection conditions.
Grahic Jump Location
Thermal enhancements due to heat spreader without and with overmolded die: Effect on Ψjb for a 25 mm FC-PBGA package with HDI substrate in natural and forced convection cooling.

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