A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

[+] Author and Article Information
Wataru Nakayama

ThermTech International, 920-7 Higashi Koiso, Oh-Iso, Kanagawa 255-0004, Japane-mail: WatNakayama@aol.com

Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima

Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan

J. Electron. Packag 126(4), 440-448 (Jan 24, 2005) (9 pages) doi:10.1115/1.1827259 History: Received April 25, 2004; Revised April 30, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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Airflow streamlines in the system box: (a) The case where Heater/PCB is located closest to the active fan (placement No. 5 and the fan at F1 active); (b) the case where Heater/PCB is located farthest from the active fan (placement No. 8 and the fan at F3 active)
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Contributions from geometric parameters (A∼B2) to thermal resistance variations caused by shuffling of the components in the system box: the cases of one-fan operation (F1,F2,F3), two-fan operation (F1/F2,F1/F3,F2/F3), and three-fan operation (F1/F2/F3)
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Proposed hierarchical organization of design work
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Eight placement patterns corresponding to the two-level factorial table [Table 3(b)]box
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Starter pattern of component placement in the system
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Thermal resistances for eight placement patterns: the cases of one-fan operation
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Thermal resistances for eight placement patterns: the cases of three-fan operation




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