0
RESEARCH PAPER

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

[+] Author and Article Information
Wataru Nakayama

ThermTech International, 920-7 Higashi Koiso, Oh-Iso, Kanagawa 255-0004, Japane-mail: WatNakayama@aol.com

Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima

Shinko Electric Industries Co. Ltd., Advanced Product Design & Development Division, Engineering Department, 80 Oshimada-Cho, Nagano, Nagano 381-2287, Japan

J. Electron. Packag 126(4), 440-448 (Jan 24, 2005) (9 pages) doi:10.1115/1.1827259 History: Received April 25, 2004; Revised April 30, 2004; Online January 24, 2005
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.

References

Nakayama,  W., 1996, “Thermal Management of Electronic Equipment: Research Needs in the Mid-1990s and Beyond,” Appl. Mech. Rev., 49(10), Pt. 2, pp. S167–S174.
Nakayama, W., 2001, “An Approach to Fast Thermal Design of Compact Electronic Systems: A JSME Project,” Proc. InterPACK, July, Kauai, HI, ASME Paper No. IPACK2001-15532.
Nakayama, W., 2001, “Emerging New Roles of CFD Simulation in Competitive Market Environment,” Proc. 7th THERMINIC Workshop, September 24–27, 2001, Paris, France, pp. 223–229.
Nakayama, W., 2003, “The Build-up Approach to Combat Complexity and Uncertainties in Thermal Analysis of Compact Electronic Equipment: A JSME Project,” 6th ASME-JSME Thermal Engineering Joint Conference, March 16–20, 2003, Hawaii, Paper TED-AJ03-566.
Vinke,  H., and Lasance,  C. J. M., 1997, “Compact Models for Accurate Thermal Characterization of Electronic Parts,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, pp. 411–419.
Nakayama,  W., 2000, “Thermal Issues in Microsystems Packaging,” IEEE Trans. Adv. Packag., 23(4), pp. 602–607.
Nakayama,  W., 2003, “A Methodology to Cope With Geometrically Complex Heat Transfer Systems; The Cases of Heat Conduction Through Composite Slabs,” Int. J. Heat Mass Transfer, 46, pp. 3397–3409.
Taguchi, G., 1987, Systems of Experimental Design: Engineering Methods to Optimize Quality and Minimize Cost, UNIPUB/Kraus International, White Plains, New York (The original Japanese 3rd version was published from Maruzen, Tokyo, 1976).
Kraycir, J. R., Cleverley, D. S., Levine, R. F., and Lorenzen, J. A., 1997, “Package Manufacture,” Chapter 6 of Microelectronics Packaging Handbook, Technology Drivers, Part I, R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein (eds.), Chapman & Hall, New York, pp. I-556–619.
May, G. S., 2002, “Fundamentals of Package Manufacturing,” Chapter 20 of Fundamentals of Microsystems Packaging, R. R. Tummala (ed.), McGraw-Hill, New York, pp. 780–844.
Yu, Q., Kashiwamura, T., Shiratori, M., and Yamada, T., 1999, “Optimal and Robust Design of Nonlinear Structures Under Uncertain Loads Using Statistical Optimization Method,” Computer Aided Optimum Design of Structures VI, S. Hernandez, A. J. Kassab, and C. A. Brebbia (eds.), WIT Press, Southampton, Boston, pp. 97–105.
Design Director Plus, Statistical Design Support System, User Manual, NHK Co., Tokyo, Japan, 2001.
Kirby, M., 2001, Geometric Data Analysis, Wiley, New York, pp. 51–61.

Figures

Grahic Jump Location
Proposed hierarchical organization of design work
Grahic Jump Location
Eight placement patterns corresponding to the two-level factorial table [Table 3(b)]box
Grahic Jump Location
Starter pattern of component placement in the system
Grahic Jump Location
Thermal resistances for eight placement patterns: the cases of one-fan operation
Grahic Jump Location
Thermal resistances for eight placement patterns: the cases of three-fan operation
Grahic Jump Location
Contributions from geometric parameters (A∼B2) to thermal resistance variations caused by shuffling of the components in the system box: the cases of one-fan operation (F1,F2,F3), two-fan operation (F1/F2,F1/F3,F2/F3), and three-fan operation (F1/F2/F3)
Grahic Jump Location
Airflow streamlines in the system box: (a) The case where Heater/PCB is located closest to the active fan (placement No. 5 and the fan at F1 active); (b) the case where Heater/PCB is located farthest from the active fan (placement No. 8 and the fan at F3 active)

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In