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RESEARCH PAPER

Thermal Model of a Thinned-Die Cooling System

[+] Author and Article Information
N. Boiadjieva

Credence Systems Corporation, 150 Baytech Drive, San Jose, CA 95134e-mail: nina_boiadjieva@credence.com

P. Koev

Department of Mathematics, Massachusetts Institute of Technology, Cambridge, MA 02139e-mail: plamen@math.mit.edu

J. Electron. Packag 126(4), 435-439 (Jan 24, 2005) (5 pages) doi:10.1115/1.1826079 History: Received April 23, 2004; Revised June 22, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Eiles, T. M., Hunt, D., and Chi, D., 2000, “Transparent Heat Spreader for Backside Optical Analysis of High Power Microprocessors,” Proc 26th ASM International Symposium for Testing and Failure Analysis, Bellevue, WA, p. 547.
Boiadjieva, N., Kelleher, C., Dajee, G., and Nadig, S., 2003, “Novel Heat Spreader for the Optical Probing of PC Board Mounted Flip Chips,” Proc 19th IEEE SEMI-THERM Symposium, San Jose, CA.
Weizman, Y., Shperber, S., and Baruch, E., 2001, “Calibration Technique for MCT FPA Used for Backside Emission,” Proc 27th ASM International Symposium for Testing and Failure Analysis, Santa Clara, CA, p. 161.
Hutcheson, D., 2002, “Climbing Reticle Costs,” The Chip Insider™, August 15.
Hecht, E., and Zajac, A., 1974, Optics, Addison-Wesley Publishing Company, Reading, pp. 299–300.
Dajee, G., Goldblatt, N., Lundquist, T., Kasapi, S., and Wilsher, K., 2001, “Practical, Non-Invasive Optical Probing for Flip-Chip Devices,” Proc 32nd IEEE International Test Conference, Baltimore, MD, p. 433.
Goldblatt, N., Leibowitz, M., and Lo, W., 2001, “Unique and Practical IC Timing Analysis Tool Utilizing Intrinsic Photon Emission,” Proc 12th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, Arcachon, France, Microelectronic Reliability, Vol. 41, p. 1507.
Ogata, K., 1997, Modern Control Engineering, Prentice–Hall, Upper Saddle River, NJ, Chap. 1, p. 6.
Haberman, C., 1998, Elementary Applied Partial Differential Equations, Prentice–Hall, NJ, 3rd ed., Chap. 2, pp. 40–66.

Figures

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Thermal system assembly
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Half cross section of thermal system–lens assembly
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Control block diagram of the thermal system
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Temperature variance between diamond window and HS temperature with 0°C air and (5.66×10−3) m3/s=(12 scfm)
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Temperature of the HS as a function of air temperature for three different flow rates and constant device power of 50 W
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Temperature of the HS for different airflow rates. The relationship here is exponential.
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Half cross section of components interface
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System representation as 1D non-uniform rod
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System representation as 1D non-uniform rod

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