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RESEARCH PAPER

Thermal Model of a Thinned-Die Cooling System

[+] Author and Article Information
N. Boiadjieva

Credence Systems Corporation, 150 Baytech Drive, San Jose, CA 95134e-mail: nina_boiadjieva@credence.com

P. Koev

Department of Mathematics, Massachusetts Institute of Technology, Cambridge, MA 02139e-mail: plamen@math.mit.edu

J. Electron. Packag 126(4), 435-439 (Jan 24, 2005) (5 pages) doi:10.1115/1.1826079 History: Received April 23, 2004; Revised June 22, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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Thermal system assembly
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Half cross section of thermal system–lens assembly
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Control block diagram of the thermal system
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Temperature variance between diamond window and HS temperature with 0°C air and (5.66×10−3) m3/s=(12 scfm)
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Temperature of the HS as a function of air temperature for three different flow rates and constant device power of 50 W
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Temperature of the HS for different airflow rates. The relationship here is exponential.
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Half cross section of components interface
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System representation as 1D non-uniform rod
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System representation as 1D non-uniform rod

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