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RESEARCH PAPER

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

[+] Author and Article Information
Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause

Final Manufacturing Technology Center, Semiconductor Products Sector, Motorola Inc., 2100 Elliot Road, Mail Drop EL 725, Tempe, AZ 85284

J. Electron. Packag 126(4), 429-434 (Jan 24, 2005) (6 pages) doi:10.1115/1.1827257 History: Received April 19, 2004; Revised July 01, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Figures

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QFN package thermal trends (Rja vs body size)
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Typical QFN package cross section
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3D view of the QFN package layout
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GaAs die layout (top view)
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Die attached to copper paddle and wire bonded
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QFN package cross-sectional view—four layer PCB
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5×5 PQFN package top view
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(a,b) Free convection setup—flow and thermal fields
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QFN die surface—extreme case (0.194 W+0.814 W)
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QFN die surface—typical case (0.111 W+0.546 W)
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PQFN die surface—extreme case (0.194 W+0.814 W)
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Uncapped package/substrate stack-up on test fixture
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IR measurement test fixture—general view
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(a,b) dc power is applied to first and to both heat stages
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(a,b) Simulation vs IR measurement thermal fields

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