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RESEARCH PAPER

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

[+] Author and Article Information
Yoji Kitamura, Masaru Ishizuka

Toyama Prefectural University, Kosugi, Toyama 939-0398, Japan

J. Electron. Packag 126(4), 423-428 (Jan 24, 2005) (6 pages) doi:10.1115/1.1827256 History: Received April 18, 2004; Revised April 25, 2004; Online January 24, 2005
Copyright © 2004 by ASME
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References

Gebhart, B., Jaluria, Y., Mahajan, R. L., and Sammakia, B. G., 1988, Buoyancy-Induced Flow and Transport, Hemisphere, New York.
Tang,  L., and Joshi,  Y. K., 1999, “Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosures,” ASME J. Electron. Packag., 121(2), pp. 108–115.
Maudgal,  V. K., 1997, “Thermal Phenomena in Compact Electronic Enclosures: A Numerical Study,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20(3), pp. 286–294.
Yu, E., and Joshi, Y. K., 1998, “Natural Convection Air Cooling of Electronic Components in Partially Open Compact Horizontal Enclosures,” Itherm’98, Proc. of Sixth Intersociety Conference on Thermal and Thermomechnical Phenomena in Electronic Systems, pp. 51–57.
Adams,  V. H., Joshi,  Y., and Blackburn,  D. L., 1999, “Three Dimensional Study of Combined Conduction, Radiation and Natural Convection From Discrete Heat Sources in a Horizontal Narrow Aspect Ratio Enclosure,” ASME J. Heat Transfer, 12(4), pp. 992–1001.
Ortega,  A., and Lall,  B. S., 1998, “Natural Convection Air Cooling of a Discrete Heat Source on a Conducting Board in a Shallow Horizontal Enclosure,” ASME J. Electron. Packag., 120(1), pp. 89–97.
Calmidi, V. V., and Sathe, S. B., 2000, “Numerical Analysis of Buoyancy-Induced Flow and Heat Transfer in an Enclosure With Vents,” HTD-Vol. 366-4, Proc. of ASME Heat Transfer Division-2000, ASME, New York, Vol. 4, pp. 407–411.
Ishizuka,  M., 1998, “The Effect of the Outlet Area and the Location of the Main Power Supply Unit on the Cooling Capability Through Naturally Air Cooled Electronic Equipment Casings,” IMechE Journal-Proc. Inst. Mech. Eng. Part A,212, pp. 381–383.
Incropera, F. P., and Dewitt, D. P., Introduction to Heat Transfer, Wiley, New York, NY, 1990.
Coxe III, W. K., Solbrekken, G. L., Yazawa, K., and Bar-Cohen, A., “Experimental Modeling of the Passive Cooling of Notebook Computers,” The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, California, USA, 2002, pdf.1320.

Figures

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Experiment apparatus and thermocouple locations
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Grid system on the model
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Influence of the number of meshes on temperature rise of the heater surface and air inside enclosure casing at 30 W
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Temperature rise distributions at a height of 31 mm from the base
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Effect of inclination on temperature rise of block heater surface
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Effect of inclination on temperature rise of the inside casing
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Relationship between Qs and ΔTm
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Effect of inclination on the volume flow-rate ratio compared to horizontal base case
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Distributions of temperature rise and velocity vector (vertical sections)
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Distributions of temperature rise and velocity vector (horizontal sections)

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