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RESEARCH PAPER

Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging

[+] Author and Article Information
I. Guven, V. Kradinov, J. L. Tor, E. Madenci

Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson, AZ 85721

J. Electron. Packag 126(3), 398-405 (Oct 06, 2004) (8 pages) doi:10.1115/1.1773855 History: Received April 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Lee,  W. W., Nguyen,  L. T., and Selvaduray,  G. S., 2000, “Solder Joint Fatigue Models: Review and Applicability to Chip Scale Packages,” Microelectron. Reliab., 40, pp. 231–244.
Iannuzzelli,  R. J., Pitarresi,  J. M., and Prakash,  V., 1996, “Solder Joint Reliability Prediction by the Integrated Matrix Creep Method,” ASME J. Electron. Packag., 118, pp. 55–61.
Syed, A., 1997, “Factors Affecting Creep-Fatigue Interaction in Eutectic Sn/Pb Solder Joints,” Advances in Electronic Packaging, ASME EEP-Vol. 19-2, pp. 1535–1532.
Darveaux, R., 1996, “How to Use Finite Element Analysis to Predict Solder Joint Fatigue Life,” Proc. 6th International Congress on Experimental Mechanics, Elsevier, New York, pp. 41–48.
Lau, J., Chang, C., and Lee, S. W. R., 2000, “Solder Joint Crack Propagation Analysis of Wafer-Level Chip Scale Package on Printed Circuit Board Assemblies,” Proc. 50th Electronic Components and Technology Conference, IEEE, New York, pp. 1360–1368.
Anderson, T., Barut, A., Guven, I., and Madenci, E., 2000, “Revisit of Life Prediction Models for Solder Joints,” Proc. 50th Electronic Components and Technology Conference, IEEE, New York, pp. 1059–1063.
Sih,  G. C., 1973, “Some Basic Problems in Fracture Mechanics and New Concepts,” Eng. Fract. Mech., 5, pp. 365–377.
Pan,  T., 1994, “Critical Accumulated Strain Energy (CASE) Failure Criterion for Thermal Cycling Fatigue of Solder Joints,” ASME J. Electron. Packag., 116, pp. 163–170.
Sih,  G. C., and MacDonald,  B., 1974, “Fracture Mechanics Applied to Engineering Problems—Strain Energy Density Criterion,” Eng. Fract. Mech., 6, pp. 361–386.
Sih,  G. C., and Moyer,  E. T. 1983, “Path Dependent Nature of Fatigue Crack Growth,” Eng. Fract. Mech., 17, pp. 269–280.
Sih, G. C., 1991, Mechanics of Fracture Initiation and Propagation, Kluwer Academic Publishers, New York.
ANSYS Procedures Manual, Release 5.4, ANSYS, Inc., Canonsburg, PA, 1998.

Figures

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Description of the start, middle, and end of a cycle (shown for the third cycle) within the thermal cycle profile used in the simulation
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Schematic of the variation of dW/dV along the radial distance r from the crack front during the temperature cycle
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Flowchart of the crack growth prediction procedure
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Isometric (part of die elements not shown for clarity) top and side views of the mesh for the global model
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FEM discretization of Submodel I
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Section cut of Submodel I with inner and outer cracks
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FEM discretization and section cut of Submodel II with crack surfaces
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Variation of dW/dV along radial distance r for the inner crack at the end of the first load increment
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Variation of dW/dV along radial distance r for the inner crack at the end of the second load increment
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Variation of dW/dV along radial distance r for the inner crack at the end of the third load increment
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Variation of dW/dV along radial distance r for the outer crack at the end of the first load increment
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Variation of dW/dV along radial distance r for the outer crack at the end of the second load increment
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Variation of dW/dV along radial distance r for the outer crack at the end of the third load increment
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Variation of dW/dV along radial distance r for the inner crack at the end of the fourth load increment and the strain energy density factors for the specified crack growth increments until coalescence

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