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RESEARCH PAPER

Environmental Aging and Deadhesion of Polyimide Dielectric Films

[+] Author and Article Information
Steven Murray, Craig Hillman, Michael Pecht

CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742

J. Electron. Packag 126(3), 390-397 (Oct 06, 2004) (8 pages) doi:10.1115/1.1773853 History: Received April 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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Figures

Grahic Jump Location
Peel testing of metallization strips deposited on a polyimide substrate using a Dage Microtester 22 machine
Grahic Jump Location
Fit of peel strength regression model, Eq. (4), to experimental data from peel tests. Error bars represent +/− one standard deviation.
Grahic Jump Location
Overlaid stress-strain curves for samples aged at 300°C/1%RH. Stars indicate the average failure point for tests conducted following each indicated duration of aging.
Grahic Jump Location
Fit of normalized ultimate tensile strength regression model, Eq. (7), to experimental data from tensile tests. Error bars represent +/− one standard deviation.
Grahic Jump Location
Factors contributing to deadhesion of polyimide dielectric.
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Deadhesion test flow for products where adequate aging can not be practically obtained through prolonged dwells within the temperature/humidity cycling test

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