Environmental Aging and Deadhesion of Polyimide Dielectric Films

[+] Author and Article Information
Steven Murray, Craig Hillman, Michael Pecht

CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742

J. Electron. Packag 126(3), 390-397 (Oct 06, 2004) (8 pages) doi:10.1115/1.1773853 History: Received April 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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Suhir,  E., 1988, “An Approximate Analysis of Stresses in Multilayered Elastic Thin Films,” ASME J. Appl. Mech., 55, pp. 143–148.
Evans,  A. G., and Hutchinson,  J. W., 1995, “Overview No. 120: The Thermomechanical Integrity of Thin Films and Multilayers,” Acta Metall. Mater., 43(7), pp. 2507–30.
Anderson,  S. G., Meyer,  H. M., and Weaver,  J. H., 1988, “Temperature-dependent X-ray Photoemission Studies of Metastable Co/Polyimide Interface Formation,” J. Vac. Sci. Technol. A, 6(4), pp. 2205–12.
Arnold,  C., and Borgman,  L. K., 1971, “Chemistry and Kinetics of Polyimide Degradation,” American Chemical Society Polymer Preparations, 12(2), pp. 296–302.
Askins, Robert D., 1983, “Hydrolytic Degradation of Kapton Film,” report to Air Force, document AFWAL-TR-83-4125.
Campbell,  F. J., 1985, “Temperature Dependence of Hydrolysis of Polyimide Wire Insulation,” IEEE Transactions on Electrical Insulation, EI-20(1), pp. 111–6.
DeIasi,  R., and Russell,  J., 1971, “Aqueous Degradation of Polyimides,” J. Appl. Polym. Sci., 15(12), pp. 2965–74.
Bessonov, M. I., et al., 1987, Polyimides: Thermally Stable Polymers, Plenum Press, New York.
DuPont, 1997, “Kapton Polyimide Film (Summary of Properties),” document 300874A.
Turk,  M. J., , 1999, “Evaluation of the Thermal Oxidative Stability of Polyimides via TGA Techniques,” J. Polym. Sci., Part A Polym. Chem. ,37, pp. 3943–56.
Furse,  C., and Haupt,  R., 2001, “Down to the Wire,” IEEE Spectrum, 38(2), pp. 34–9.
Hutapea,  P., and Yuan,  F. G., 1999, “The Effect of Thermal Aging on the Mode-I Interlaminar Fracture Behavior of a High-Temperature IM7/LaRC-RP46 Composite,” Composites Science and Technology, 59(8), pp. 1271–86.
Mittel, K. L., 1984, Polyimides Synthesis, Characterization, and Application, Vol. 2, Plenum Press, New York.
Somasiri,  N. L. D., Zenner,  R. L. D., and Houge,  J. C., 1991, “A Process for Surface Texturing of Kapton Polyimide to Improve Adhesion to Metals,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 14(4), pp. 798–801.
St. Clair, T. L., 1990, “Structure-Property Relationships in Linear Aromatic Polyimides,” Polyimides, D. Wilson, H. D. Stenzenberger, and P. M. Hergenrother, eds., Blackie & Son, Glasgow, pp. 58–78.
Bergstresser, T. R., Bergkessel, N. E., and Poutasse, C. A., 1998, “Accelerated Humidity Durability Testing of Adhesiveless Polyimide Laminates,” Proceedings of the Fifth International Convention on Flex Circuits, San Jose, CA.
Bergstresser, T. R., et al., 1997, “Adhesion Performance of Polyimide Adhesiveless Flexible Laminates having Nickel Based Tiecoats,” Proceedings of the IPC Third Annual National Conference on Flex Circuits, Phoenix, AZ.
Bergstresser, T. R., et al., 1997, “Peel Strength of Adhesiveless Polyimide Laminates after Thermal and Chemical Exposure,” Proceedings of the Fourth International Conference on Flex Circuits, Sunnyvale, CA.
Bergstresser, T. R., et al., 1998, “The Effects of Moisture on Peel Strength of Adhesiveless Polyimide Laminates,” IPC Fourth Annual National Conference on Flexible Circuits: Meeting the Challenge of the Next Generation of Packaging, San Jose, CA, vol. 2, pp. 63–71.
Clearfield,  H. M., Furman,  B. K., and Callegari,  T. A., 1994, “The Role of Physical and Chemical Structure in the Long-Term Durability of Metal/Polyimide Interfaces,” International Journal of Microcircuits and Electronic Packaging, 17(3), pp. 228–35.
Girardeaux,  C., Chambaud,  G., and Delamar,  M., 1995, “The Polyimide (PMDA-ODA) Titanium Interface. 2. XPS Study of Polyimide Treatments and Aging,” J. Electron Spectrosc. Relat. Phenom., 74(1), pp. 57–66.
DeIasi,  R., 1973, “Hydrolytic Stability of Polyalkane Imide,” J. Appl. Polym. Sci., 17(2), pp. 659–62.
Harper,  B. D., and Rao,  J. M., 1994, “Some Effects of Water Immersion of the Mechanical Behavior of a Polyimide Film,” ASME J. Electron. Packag., 116, pp. 317–9.
IPC, 1996, “IPC-6011: Generic Performance Specification for Printed Boards.”
IPC, 1988, “IPC-6013: Qualification and Performance Specifications for Flexible Printed Boards.”
IPC, 1998, “IPC-6015: Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures.”
IPC, 1999, “IPC-6016: Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards.”
IPC, 1998, “IPC-6018: Microwave End Product Board Inspection and Test.”
Bodo,  P., and Sundgren,  J. E., 1988, “Ion Bombardment and Titanium Film Growth on Polyimide,” J. Vac. Sci. Technol. A, 6(4), pp. 2396–402.
Girardeaux,  C., Chambaud,  G., and Delamar,  M., 1996, “The Polyimide (PMDA-ODA) Titanium Interface. 3. A Theoretical Study,” J. Electron Spectrosc. Relat. Phenom., 77(2), pp. 209–20.
Ho, P. S., et al., 1991, “Chemistry, Microstructure, and Adhesion of Metal-Polymer Interfaces,” Fundamentals of Adhesion, Lieng-Huang Lee, ed., Plenum Press, New York, pp. 383–406.
Ohuchi,  F. S., and Freilich,  S. C., 1986, “Metal Polyimide Interface: A Titanium Reaction Mechanism,” J. Vac. Sci. Technol. A, 4(3), pp. 1039–45.
Jensen,  J. J., Cummings,  J. P., and Vora,  H., 1984, “Copper/Polyimide Materials System for High Performance Packaging,” IEEE Trans. Compon., Hybrids, Manuf. Technol., CHMT-7(4), pp. 384–93.
Pottiger,  M. T., Coburn,  J. C., and Edman,  J. R., 1994, “The Effect of Orientation on Thermal Expansion Behavior in Polyimide Films,” J. Polym. Sci., Part B: Polym. Phys., 32(5), pp. 825–37.
Czornyj, G., et al., 1997, “Polymers in Packaging,” Microelectronics Packaging Handbook, Part II: Semiconductor Packaging, 2nd edition, R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, ed., Chapman & Hall, New York, pp. 509–623.
DuPont, 2001, “DuPont Kapton E,” document H-78305.
Li,  M. J., , 1995, “Relative Humidity Cycle Testing on GE-HDI,” International Journal of Microelectronic Packaging, 1, pp. 13–34.
Sutton, R. F., 1998, “Hygroscopic Expansion of Polyimide Film,” IPC Printed Circuits Expo, Long Beach, CA.
Buchhold et al., 1998, “Influence of Moisture-Uptake on Mechanical Properties of Polymers used in Microelectronics,” Materials Research Society Symposium Proceedings, 511 , pp. 359–364.
Melcher,  J., Daben,  Y., and Arlt,  G., 1989, “Dielectric Effects of Moisture in Polyimide,” IEEE Trans. Electr. Insul., 24(1), pp. 31–8.
Lam,  D. C. C., Yang,  F., and Tong,  P., 1999, “Chemical Kinetic Model of Interfacial Degradation of Adhesive Joints,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 22(2), pp. 215–20.
Popelar,  S. F., Popelar,  C. H., and Kenner,  V. H., 1993, “Time-Dependent Fracture of Polyimide Films,” ASME J. Electron. Packag., 115(3), pp. 264–9.
Pecht,  M., and Wu,  X., 1994, “Characterization of Polyimides Used in High Density Interconnects,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 17(4), pp. 632–9.
Popelar, S. F., Popelar, C. H., and Kenner, V. H., 1993, “Hygothermal Effects on the Fracture of Polyimide Film,” ASME Advances in Electronic Packaging, 4 (1), p. 287–94.
Zumdahl, S. S., “Chemical Kinetics,” Chemistry, Third Edition, D. C. Heath and Co., Lexington, MA, pp. 543–93.
ASTM, 1996, “D1708-96: Standard Test Method for Tensile Properties of Plastics By Use of Microtensile Specimens.”
Neves, B., 2001, “Flexible Testing: Don’t Be A Test Dummy,” The Board Authority, March 2001, pp. 70–2.


Grahic Jump Location
Peel testing of metallization strips deposited on a polyimide substrate using a Dage Microtester 22 machine
Grahic Jump Location
Fit of peel strength regression model, Eq. (4), to experimental data from peel tests. Error bars represent +/− one standard deviation.
Grahic Jump Location
Overlaid stress-strain curves for samples aged at 300°C/1%RH. Stars indicate the average failure point for tests conducted following each indicated duration of aging.
Grahic Jump Location
Fit of normalized ultimate tensile strength regression model, Eq. (7), to experimental data from tensile tests. Error bars represent +/− one standard deviation.
Grahic Jump Location
Factors contributing to deadhesion of polyimide dielectric.
Grahic Jump Location
Deadhesion test flow for products where adequate aging can not be practically obtained through prolonged dwells within the temperature/humidity cycling test




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