0
RESEARCH PAPER

Environmental Aging and Deadhesion of Polyimide Dielectric Films

[+] Author and Article Information
Steven Murray, Craig Hillman, Michael Pecht

CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742

J. Electron. Packag 126(3), 390-397 (Oct 06, 2004) (8 pages) doi:10.1115/1.1773853 History: Received April 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Peel testing of metallization strips deposited on a polyimide substrate using a Dage Microtester 22 machine
Grahic Jump Location
Fit of normalized ultimate tensile strength regression model, Eq. (7), to experimental data from tensile tests. Error bars represent +/− one standard deviation.
Grahic Jump Location
Factors contributing to deadhesion of polyimide dielectric.
Grahic Jump Location
Deadhesion test flow for products where adequate aging can not be practically obtained through prolonged dwells within the temperature/humidity cycling test
Grahic Jump Location
Fit of peel strength regression model, Eq. (4), to experimental data from peel tests. Error bars represent +/− one standard deviation.
Grahic Jump Location
Overlaid stress-strain curves for samples aged at 300°C/1%RH. Stars indicate the average failure point for tests conducted following each indicated duration of aging.

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In