Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

[+] Author and Article Information
Liu Bao-Min, Mui Y. C.

Advanced Micro Devices (S), Singapore 469032

J. Electron. Packag 126(3), 384-389 (Oct 06, 2004) (6 pages) doi:10.1115/1.1774197 History: Received August 01, 2003; Revised April 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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Grahic Jump Location
Impact of the water flow rate
Grahic Jump Location
Impact of opening size heater efficiency
Grahic Jump Location
Impact of heater size on its efficiency
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Temperature profiles through heater
Grahic Jump Location
Microprocessor package and water-cooling thermal head
Grahic Jump Location
Overall temperature profile
Grahic Jump Location
Impact of the channel height
Grahic Jump Location
Impact of the base thickness
Grahic Jump Location
Overall thermal stress profile in the DUT
Grahic Jump Location
Thermal stresses in the C4 layer
Grahic Jump Location
Thermal stress in heater plate
Grahic Jump Location
Thermal warpages in the lid



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