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RESEARCH PAPER

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

[+] Author and Article Information
Liu Bao-Min, Mui Y. C.

Advanced Micro Devices (S), Singapore 469032

J. Electron. Packag 126(3), 384-389 (Oct 06, 2004) (6 pages) doi:10.1115/1.1774197 History: Received August 01, 2003; Revised April 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Figures

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Microprocessor package and water-cooling thermal head
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Overall temperature profile
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Impact of the channel height
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Impact of the base thickness
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Impact of the water flow rate
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Impact of opening size heater efficiency
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Impact of heater size on its efficiency
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Temperature profiles through heater
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Overall thermal stress profile in the DUT
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Thermal stresses in the C4 layer
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Thermal stress in heater plate
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Thermal warpages in the lid

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