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RESEARCH PAPER

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

[+] Author and Article Information
Liu Bao-Min, Mui Y. C.

Advanced Micro Devices (S), Singapore 469032

J. Electron. Packag 126(3), 384-389 (Oct 06, 2004) (6 pages) doi:10.1115/1.1774197 History: Received August 01, 2003; Revised April 01, 2004; Online October 06, 2004
Copyright © 2004 by ASME
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References

Parry, John et al., 2000, “Multi Physics Modeling for Electronics Design,” Proceedings of ITHERM2000, Las Vegas pp. 86–93.
Carmona,  M. , 2003, “Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump,” ASME J. Electron. Packag., 125, pp. 527–530.
Warner, M., et al., 2001, “FLO/STRESS: An Integrated Stress Solver for the CFD tool FLOTHERM,” Proceedings of IPACK 2001, Kauai, Hawaii.
Tummala, Rao R., Rymaszewski, Eugene J., and Klopfenstein, Alan G., 1997, Microelectronics Packaging Handbook, Chapman & Hall, New York.
Baomin, Liu, et al., 2001, “CFD modeling of a CPGA Package with Experimental Validation,” Proc. of APACK 2001, Singapore, pp. 531–537.
Baomin, Liu, et al., 2003, “Full System Level Thermal Analysis of a Burn-in Rack,” Proc. Of EPTC 2003, Singapore, pp. 606–610.
Flomerics, 2002, Flotherm Version 3.2 Training Notes, Singapore.
Parry, John, et al., 2002, “An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices,” Proc. of 8th ITHERM Conference, San Diego CA, pp. 862–868.

Figures

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Microprocessor package and water-cooling thermal head
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Overall temperature profile
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Impact of the channel height
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Impact of the base thickness
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Impact of the water flow rate
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Impact of opening size heater efficiency
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Impact of heater size on its efficiency
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Temperature profiles through heater
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Overall thermal stress profile in the DUT
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Thermal stresses in the C4 layer
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Thermal stress in heater plate
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Thermal warpages in the lid

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